Cooling device and method for double-sided chemical mechanical grinding and polishing of wafer

Abstract

The invention discloses a cooling device and a cooling method for the double-sided chemical mechanical grinding and polishing of wafers. The cooling device comprises a cooling mechanism, a regulating system and a display control system which are arranged on a grinding and polishing mechanism, wherein the cooling mechanism comprises a cooling tray body, a cooling cavity is formed in the cooling tray body through cooling channels, and the cooling channels include a channel of which the inner ring is circular and a channel of which the outer ring is annularly waved. The device disclosed by the invention is simple in structure, and convenient to operate; when the device is used, after a wafer is placed in a planet wheel and a grinding fluid containing a moderate amount of abrasive particles is added, then a required working temperature is set through an operation panel, and the device is started, so that the working temperature can be monitored in real time through a display panel. A cooling fluid carries out forced cooling on a lower abrasive disk along a specific cooling channel, so that the processing temperature of wafers is effectively controlled, the surface quality of ground and polished wafers is improved, and the fragmentation probability of wafers is reduced.

Description

technical field [0001] The invention relates to the field of cooling devices, in particular to a cooling device and method for double-sided chemical mechanical grinding and polishing of wafers. Background technique [0002] During the processing of the wafer, the surface needs to be ground and polished to eliminate the saw marks and damage layers generated in the single crystal cutting process, thereby improving the geometric accuracy of the wafer, in order to obtain the local surface flatness, surface roughness and Very low brightness mirror to meet IC process requirements. In the mechanochemical grinding and polishing process, the chemical reaction is exponentially related to the temperature change. The increase of temperature leads to intensified chemical reaction, which makes the polishing consistency of the wafer surface poor, resulting in uneven planarization effect; while at low temperature, the chemical reaction speed slows down, resulting in reduced chemical grindi...

AI Technical Summary

Problems solved by technology

However, during the use of planetary grinding and polishing equipment, the heat generated is unevenly distributed, and the traditional grinding and polishing liquid takes away the heat of the grinding and polishing disc during the grinding and polishing process, and the cooling method is passive, which cannot play a good role in continuous work. The cooling effect and precise temperature control lead to the deformation of the grinding and polishing disc, which seriously affects the flatness of the workpiece

Images