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Ceramic riving knife, surface roughening treatment method thereof, and semiconductor packaging method

A surface roughening and treatment method technology, applied in the field of ceramic materials, can solve problems such as reducing the service life of welding wires, and achieve the effect of eliminating internal stress and high service life

Active Publication Date: 2022-03-15
SHENZHEN SUNTECH ADVANCED CERAMICS
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, when the surface of the ceramic riving knife is roughened by traditional heat treatment and chemical treatment, thermal stress will be generated on the riving knife, which will greatly reduce the service life of the welding wire.

Method used

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  • Ceramic riving knife, surface roughening treatment method thereof, and semiconductor packaging method
  • Ceramic riving knife, surface roughening treatment method thereof, and semiconductor packaging method
  • Ceramic riving knife, surface roughening treatment method thereof, and semiconductor packaging method

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Experimental program
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Effect test

Embodiment 1

[0043] The manufacture process of the ceramic riving knife of the present embodiment is specifically as follows:

[0044] Put the semi-finished alumina ceramic rivet in a microwave processing equipment, set the heating rate at 3°C / min, raise the temperature to 1450°C, and keep it warm for 3.5 hours to obtain the ceramic rivet of this embodiment.

Embodiment 2

[0046] The manufacture process of the ceramic riving knife of the present embodiment is specifically as follows:

[0047] Put the semi-finished alumina ceramic rivet in a microwave processing equipment, set the heating rate at 2°C / min, raise the temperature to 1400°C, and then keep it warm for 4 hours to obtain the ceramic rivet of this embodiment.

Embodiment 3

[0049] The manufacture process of the ceramic riving knife of the present embodiment is specifically as follows:

[0050] Put the semi-finished alumina ceramic rivet in a microwave processing equipment, set the heating rate at 5°C / min, raise the temperature to 1500°C, and then keep it warm for 3 hours to obtain the ceramic rivet of this embodiment.

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Abstract

The invention relates to a ceramic chopper, a surface roughening treatment method thereof, and a semiconductor packaging method. The surface roughening treatment method of the above-mentioned ceramic riving knife includes the following steps: providing a semi-finished ceramic riving knife; subjecting the semi-finished ceramic riving knife to microwave treatment to obtain a ceramic riving knife, wherein the temperature of the microwave treatment is 1200 ° C ~ 1600 ° C, and the heating rate is 0.2°C / min~15°C / min, holding time 0.5h~12h. The surface roughening treatment method of the above-mentioned ceramic riving knife utilizes the uniformity and stability of the microwave to carry out surface treatment on the semi-finished ceramic riving knife to eliminate internal stress, and at the same time control the parameters such as the microwave treatment temperature, heating rate, and holding time to obtain different surface roughness. Compared with the traditional heat treatment, the roughness of the chopper can satisfy Cu, Au, Ag alloy wire welding, and the service life of the welding wire is longer.

Description

technical field [0001] The invention relates to the field of ceramic materials, in particular to a ceramic chopper, a surface roughening treatment method thereof, and a semiconductor packaging method. Background technique [0002] The ceramic rivet is an axisymmetric ceramic tool with a vertical hole. Because of its advantages of high hardness, high wear resistance, high temperature resistance, chemical corrosion resistance, high surface finish and high dimensional accuracy, it is widely used in the field of semiconductor wire bonding welding. play an irreplaceable role. Wire bonding is the process of pasting the chip electrode face up on the package base, and connecting the chip electrode and the corresponding electrode on the lead frame with a wire by welding. The purpose of wire bonding is to electrically conduct the chip with the external packaging frame to ensure the smooth transmission of electrical signals. The choice of metal wire will affect the welding quality, d...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B28B11/24H01L21/60
CPCB28B11/241H01L24/78H01L24/85
Inventor 朱佐祥谭毅成
Owner SHENZHEN SUNTECH ADVANCED CERAMICS
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