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Bismaleimide with asymmetric molecular structure, its preparation method and its application in the preparation of composite resin

A bismaleimide and molecular structure technology, applied in the field of microelectronic packaging materials, can solve the problems of high melting point, poor solubility of bismaleimide, high melt viscosity, etc.

Active Publication Date: 2018-11-13
FUDAN UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] An object of the present invention is to provide a bismaleimide monomer with an asymmetric molecular structure, to improve the existing defects of bismaleimide poor solubility, high melting point, large melt viscosity and narrow processing temperature window

Method used

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  • Bismaleimide with asymmetric molecular structure, its preparation method and its application in the preparation of composite resin
  • Bismaleimide with asymmetric molecular structure, its preparation method and its application in the preparation of composite resin
  • Bismaleimide with asymmetric molecular structure, its preparation method and its application in the preparation of composite resin

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0057] Embodiment 1 The synthesis of bismaleimide monomer (I-1) and the preparation of BT resin

[0058] In this example, R 1 , R 2 , R 3 and R 6 Respectively select the hydrogen atom, R 4 Select CH 3 , R 5 Choose ethyl, X choose O, and choose toluene / N,N-dimethylformamide (volume ratio 2 / 1) as an example for the mixed solvent of toluene to synthesize unsymmetrical bismaleimide (I-1):

[0059] 2-(4'-N-maleimido)phenyl-2-[4'-(4"-N-maleimido)phenoxyl]phenylbutane, namely: 2-(4'-N-maleimido)phenyl- 2-[4'-(4"-N-maleimido) phenoxy] phenylbutane; and use it to further prepare composite resin (BT resin), and bisphenol A cyanic acid is selected as the cyanate Esters, without the addition of allylphenols, epoxies and catalysts.

[0060] The preparation process is as follows:

[0061] (1) Synthesis of bismaleimide monomer (Ⅰ-1)

[0062]

[0063] Weigh 3.32g (0.01mol) of dibasic primary amine (II-1) containing an asymmetric structure and 1.96g (0.02mol) of maleic anhydride i...

Embodiment 2

[0073] Example 2 The synthesis of bismaleimide monomer (I-2) and the preparation of BT resin

[0074] In this example, R 1 , R 2 , R 3 and R 6 Select the hydrogen atom, R 4 and R 5 Select CH respectively 3 , X selects the mixed solvent of O and toluene and selects toluene / N, N-dimethylformamide (volume ratio is 2 / 1) as an example to synthesize unsymmetrical bismaleimide (Ⅰ-2):

[0075] 2-(4'-N-maleimido)phenyl-2-[4'-(4"-N-maleimido)phenoxyl]phenylpropane, namely: 2-(4'-maleimido)phenyl-2- [4'-(4"-maleimido) phenoxy] phenylpropane; and use it to further prepare composite resin (BT resin), cyanate choose bisphenol A type cyanate, epoxy resin Select bisphenol A type epoxy resin without adding allyl phenolic compounds and catalysts.

[0076] The preparation process is as follows:

[0077] (1) Synthesis of bismaleimide monomer (Ⅰ-2)

[0078]

[0079] Weigh 3.18g (0.01mol) of dibasic primary amine (II-2) containing an asymmetric structure and 1.96g (0.02mol) of maleic a...

Embodiment 3

[0086] Example 3 The synthesis of bismaleimide monomer (I-3) and the preparation of BT resin

[0087] In this example, R 1 , R 2 , R 3 and R 6 Select the hydrogen atom, R 4 Select CH 3 , R 5 Select benzene ring, X select O, and toluene mixed solvent select toluene / N,N-dimethylformamide (volume ratio 2 / 1) as an example to synthesize unsymmetrical bismaleimide (Ⅰ-3):

[0088] 1-(4'-N-maleimido)phenyl-1-[4'-(4"-N-maleimido)phenoxyl]phenyl-1-phenylet hane, namely 1-(4'-N-maleimido group ) phenyl-1-[4'-(4"-N-maleimido) phenoxy] phenyl-1-phenylethane, and further prepare composite resin (BT resin) with it, cyanide Bisphenol A cyanate is selected as the ester, 2,2'-diallyl bisphenol A is selected as the allyl phenol compound, dibutyltin laurate is selected as the catalyst, and no epoxy resin is added.

[0089] The preparation process is as follows:

[0090] (1) Synthesis of bismaleimide monomer (Ⅰ-3)

[0091]

[0092] Weigh 3.80g (0.01mol) of dibasic primary amine (II-3)...

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Abstract

The invention relates to the technical field of microelectronic packaging materials and discloses bimaleimide with an asymmetric molecular structure. The structure of the bimaleimide is as shown in a general formula (I) which is described in the specification. The bimaleimide has good dissolvability and can be dissolved in most organic solvents; and the bimaleimide has low melt viscosity and a wide processing temperature window, which facilitates further processing and utilization of the bimaleimide. The invention also provides two preparation methods for the bimaleimide. Moreover, the invention also provides application of the bimaleimide in preparation of triazine composite resin. The composite resin with good dissolvability and processing properties can be prepared from the bimaleimide without addition of a third component.

Description

technical field [0001] The invention belongs to the technical field of microelectronic packaging materials, and in particular relates to a bismaleimide monomer structure with an asymmetric molecular structure, a method for preparing the monomer and the use of the monomer in preparing bismaleimide-three Application in oxazine composite resins. Background technique [0002] With the continuous development of microelectronic packaging technology and the comprehensive and in-depth application of microelectronic products in automobiles, ships, aircraft and other equipment, as the packaging substrate that plays an important role in supporting, protecting and interconnecting in microelectronic packaging, its materials It must also have more excellent properties (such as higher dimensional stability, lower dielectric constant, higher glass transition temperature and excellent flame retardancy) to adapt to harsh environments such as high temperature, severe cold, and high humidity. ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C07D207/452C08G73/12C08L79/08C08L63/02
CPCC07D207/452C08G73/124C08L79/085C08L63/00
Inventor 任志东肖斐
Owner FUDAN UNIV
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