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A chip-level LED light source module and manufacturing method thereof

An LED light source, chip-level technology, applied in electrical components, circuits, semiconductor devices, etc., can solve problems such as unfavorable heat conduction and easy damage, and achieve the effect of improving luminous efficiency and good mechanical strength

Active Publication Date: 2018-06-12
APT ELECTRONICS
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] However, the LED white light chip with this structure has the following defects: 1. It is easily damaged under the mechanical action of the outside world; 2. It is unfavorable for heat conduction.

Method used

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  • A chip-level LED light source module and manufacturing method thereof
  • A chip-level LED light source module and manufacturing method thereof
  • A chip-level LED light source module and manufacturing method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0038] Such as Figure 5 As shown, a chip-level LED light source module 1 is provided for this embodiment, including a PCB circuit board 10, at least one chip-level LED light source 20, cofferdam 30 and primary optical element 40; the chip-level LED light source 20 is set On the PCB circuit board 10, it is electrically connected to the PCB circuit board 10; the cofferdam 30 is arranged on the PCB circuit board 10, and is connected to the side wall of the chip-level LED light source 20 for Surrounding the side wall of the chip-level LED light source 20 ; the primary optical element 40 is disposed on the bank 30 .

[0039] Wherein, the PCB circuit board 10 includes one of aluminum-based printed circuit, ceramic-based circuit board, polymer flexible circuit board, etc. or a composite circuit board.

[0040] Such as figure 2 Shown is a schematic structural diagram of the chip-level LED light source 20 of this embodiment. The chip-level LED light source 20 includes a flip-chip ...

Embodiment 2

[0049] Embodiment 2 of the present invention is basically the same as the technical solution of Embodiment 1, and its distinguishing feature is that, as Figure 7 As shown, the shape of the primary optical element 40 is peanut. Wherein, the shape of the primary optical element may also be square, elliptical, Fresnel, honeycomb, conical, regular hexagonal, persimmon-shaped and other shapes.

Embodiment 3

[0051] Embodiment 3 of the present invention has basically the same technical solutions as Embodiments 1 and 2, and its distinguishing features are: as Figure 8 As shown, in Embodiment 2, only the light conversion layer 22 is provided above the flip-chip LED chip. Specifically, it is arranged above the epitaxial substrate layer of the flip-chip LED chip.

[0052] like Figure 9 As shown, the cofferdam 30 only includes a side wall portion 301; the side wall portion 301 is connected to the side wall of the chip-level LED light source 20; the side wall portion 301 is columnar or reflective cup-like.

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PUM

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Abstract

The invention discloses a chip-level LED (Light Emitting Diode) light source module and a manufacturing method thereof. The chip-level LED light source module comprises a PCB (Printed Circuit Board), at least one chip-level LED light source, a cofferdam and a primary optical element; the chip-level LED light source is arranged on the PCB and electrically connected with the PCB; the cofferdam is arranged on the PCB, connected with the side wall of the chip-level LED light source and used for surrounding the side wall of the chip-level LED light source; and the primary optical element is arranged on the cofferdam. The chip-level LED light source module has good mechanical strength, prevents external colloid from being easily damaged in application, and has good heat conductivity and high light effect.

Description

technical field [0001] The invention belongs to the technical field of LEDs, and in particular relates to a chip-level LED light source module and a manufacturing method thereof. Background technique [0002] White light LED chips are LED chips that can directly emit white light using Chip Scale Package (hereinafter referred to as "CSP") technology. This type of chip has the advantages of small size, large luminous angle, high current drive resistance, low manufacturing cost, and convenient downstream. Customer lighting design and other advantages. [0003] The common structural features of current LED white light chips include: flip-chip structure, electrodes are arranged at the bottom, and phosphor powder is coated on the upper surface and four sides. The phosphor layer on the upper surface and four sides is generally realized by molding and pressing semi-cured phosphor sheet technology, and the phosphor layer on the upper surface and four sides is an integrally formed st...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L33/64H01L33/50H01L33/60H01L33/48
CPCH01L33/48H01L33/50H01L33/60H01L33/64
Inventor 万垂铭姜志荣曾照明吴金明肖国伟
Owner APT ELECTRONICS