Through hole processing method of printed board
A technology of printed boards and vias, which is applied in the direction of printed circuit manufacturing, printed circuits, printed circuits, etc., can solve problems that affect the reliability of product assembly, cannot solve large holes, plug holes are not full, etc., and meet the requirements of reliability testing Requirements, obvious economic benefits, and the effect of solving hidden dangers in quality
Inactive Publication Date: 2015-12-16
NO 771 INST OF NO 9 RES INST CHINA AEROSPACE SCI & TECH
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Problems solved by technology
For large plug holes, when 0.5mmfigure 1 and figure 2 shown
The industry has also been unable to solve the problem of large hole solder plugging holes
Method used
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[0021] The present invention will be further described in detail below in conjunction with specific embodiments, which are explanations of the present invention rather than limitations.
[0022] The invention relates to a via hole plugging method for a printed board. The semi-finished printed board is normally produced to the drilled hole, and the via hole that needs to be plugged is drilled first, and then the via hole that needs to be plugged is drilled, and then the plated hole is followed by the plated hole process after the normal production until the full board is electroplated. The copper thickness is plated to the customer's requirements; the semi-finished product is normally processed before the solder mask, the residual moisture in the drying hole is used to plug the hole and cured with epoxy resin, and finally the board is ground to remove the residual resin on the board surface. The process of resin plugging can be completed above, and then the printed board semi-fi...
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The invention discloses a through hole processing method of a printed board. The processing method comprises the following steps that 1) a through hole is processed in the processed printed board, a first conductive copper layer is deposited in the through hole via chemical reaction, and then the through hole is electro-plated with a second conductive copper layer via electrochemical reaction; 2) according to the position of the through hole, a corresponding hole plugging screen is aligned into the through hole after twice coppering in a cooperative manner, epoxy resin is used to fill the through hole, and the printed board whose hole is plugged is obtained; 3) the printed board is heated for 55-60 min at the temperature of 150-155 DEG C so that the epoxy resin is solidified; and 4) the printed board in which the epoxy resin is solidified is ground to complete through hole processing of the printed board. The epoxy resin is used to plug the hole, the adhesiveness of the epoxy resin is high, the epoxy resin belongs to a mono-component system, and the baking time is short during solidification, so that the plugging quality of large holes is high, occurrence of bubble, cavity and recess in the hole is avoided, the reliability is high, and the yield rate is high.
Description
technical field [0001] The invention relates to a printed board processing technology, in particular to a processing method for a printed board via hole. Background technique [0002] In the prior art, when mounting printed board components, in order to avoid the risk of short circuit caused by soldering, the printed board via hole needs to be plugged, and its general via hole diameter is ≤0.50mm. Solder resist is usually used in the printed board industry. The method of plugging holes can meet the quality requirements. [0003] Solder resist plug holes in the outer layer of printed boards. The industry mainly uses aluminum sheets for plug holes. In the drilling process, the via holes and positioning holes of the aluminum sheets are drilled according to the drilling data, and the plug hole screen is made. The soldering ink is made by plugging first and then printing, and the process of staged temperature rise and solidification is used to make via plugs. [0004] However, ...
Claims
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Login to View More IPC IPC(8): H05K3/40
CPCH05K3/0094H05K2201/0959
Inventor 张文晗师博余华梁丽娟
Owner NO 771 INST OF NO 9 RES INST CHINA AEROSPACE SCI & TECH