A downlight with monitoring and wireless functions
A downlight and functional technology, applied in lighting and heating equipment, components of lighting devices, semiconductor devices of light-emitting elements, etc., can solve the problem of not being able to record the switching frequency and switching time of downlights, improving indoor safety, and affecting aesthetics and other issues, to achieve the effect of rich functions, improved indoor safety, and high production efficiency
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Embodiment 1
[0029] See Figure 1-5 , a downlight with monitoring and wireless functions, including a downlight body 10, the downlight body 10 includes a lamp holder 1, a heat dissipation base 2 fixed on the bottom of the lamp holder 1, a bottom plate 3 fixed on the bottom of the heat dissipation base 2, The heat dissipation cavity 21 opened in the heat dissipation base 2, the aluminum substrate 4 and the PCB board 5 fixed in the heat dissipation cavity 21, and the glass plate 31 fixed in the middle of the bottom plate 3, a monitoring device for monitoring cameras, and a monitoring device for WIFI For the connected WIFI device, a plurality of LED lights 41 are fixed on the bottom of the aluminum substrate 4 , and the PCB board 5 is electrically connected to the monitoring device, the WIFI device, and the LED lights 41 respectively.
[0030] The downlight of the present invention can monitor whether people come in the room by using a monitoring device, thereby improving indoor safety. The ...
Embodiment 2
[0045] The difference between this embodiment and above-mentioned embodiment 1 is:
[0046] The aluminum substrate 4 is made of a high heat dissipation aluminum alloy material, and the high heat dissipation aluminum alloy material includes the following elements by weight percentage: Mn: 0.8%, Co: 0.1%, Fe: 0.15%, Ni: 0.15%, Ti: 0.05%, Cr: 0.05%, Si: 0.06%, Mg: 0.05%, Zn: 0.04%, Ca: 0.03%, V: 0.02%, Cu: 0.01%, Zr: 0.01%, Ce: 0.01%, balance Al is Al, and the weight ratio of Fe and Si is 2.5:1.
[0047] The preparation method of the aluminum substrate 4 includes the following steps: adding Mn, Co, Fe, Ni, Ti, Cr, Si, Mg, Zn, Ca, V, Cu, Zr and Al in proportion by weight percentage into the melting furnace Melting, when the alloy is melted by heating up, add the Ce intermediate alloy block proportioned by weight percentage for smelting for 50min, and after the Ce intermediate alloy block is completely melted, the temperature is raised to 720°C, and the hexachloroethane that accou...
Embodiment 3
[0051] The difference between this embodiment and above-mentioned embodiment 1 is:
[0052] The aluminum substrate 4 is made of a high heat dissipation aluminum alloy material, and the high heat dissipation aluminum alloy material includes the following elements by weight percentage: Mn: 0.9%, Co: 0.15%, Fe: 0.175%, Ni: 0.18, Ti: 0.08 %, Cr: 0.08%, Si: 0.07%, Mg: 0.06%, Zn: 0.05%, Ca: 0.04%, V: 0.03%, Cu: 0.02%, Zr: 0.02%, Ce: 0.02%, and the balance is The weight ratio of Al, Fe and Si is 2.5:1.
[0053] The preparation method of the aluminum substrate 4 includes the following steps: adding Mn, Co, Fe, Ni, Ti, Cr, Si, Mg, Zn, Ca, V, Cu, Zr and Al in proportion by weight percentage into the melting furnace Melting, when the alloy is melted by heating up, add the Ce intermediate alloy ingot proportioned by weight percentage for smelting for 50min, after the Ce intermediate alloy block is completely melted, the temperature is raised to 725°C, and the hexachloroethane which accou...
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