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Microminiature cooling system of semi-closed type electronic equipment based on compression refrigeration

A compression refrigeration, semi-hermetic technology, used in refrigerators, compressors, refrigeration and liquefaction, etc., can solve the problems of easy condensation and condensation of evaporators, short circuit of electronic components, etc., to eliminate hidden dangers of electrical short circuits and avoid crosstalk. , the effect of reducing the loss of cooling capacity

Inactive Publication Date: 2015-12-23
SOUTHWEST CHINA RES INST OF ELECTRONICS EQUIP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0004] Aiming at the technical problem that the compression refrigeration in the prior art is very easy to condense around the evaporator and easily cause risks such as short circuit of electronic components, the present invention discloses a semi-closed cooling system for electronic equipment based on compression refrigeration. system

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  • Microminiature cooling system of semi-closed type electronic equipment based on compression refrigeration
  • Microminiature cooling system of semi-closed type electronic equipment based on compression refrigeration
  • Microminiature cooling system of semi-closed type electronic equipment based on compression refrigeration

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Embodiment Construction

[0017] The specific implementation manners of the present invention will be described in detail below in conjunction with the accompanying drawings.

[0018] The invention discloses a semi-closed micro cooling system for electronic equipment based on compression refrigeration, which specifically includes 1 micro compressor, 2 condenser, 3 filter, 4 capillary tube, 5 evaporator, 6 control system, and connecting pipeline (1-2, 2-3, 4-5, 5-1) and 7 refrigerants filled in the pipeline, 8 inner frame, 9 air desiccant cylinder, 10 return fan, 11 electronic components to be cooled, etc. composition. Among them, components 1-7 and connecting pipelines are the basic components of a compression refrigeration cycle.

[0019] The micro compressor 1 can be a direct current variable frequency compressor, controlled and driven by a control system.

[0020] The second condenser can be an air-to-liquid heat exchanger, and one or a group of axial flow fans or centrifugal fans working together...

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Abstract

The invention relates to the technical field of heat dissipaters, and discloses a microminiature cooling system of semi-closed type electronic equipment based on compression refrigeration. The microminiature cooling system specifically comprises a compression refrigeration system and an inner enclosure frame, wherein the compression refrigeration system comprises a compressor, a condenser, a capillary and an evaporator which are connected in sequence through connection pipelines; an air dryer barrel, a backflow fan, an evaporator and an electronic element to be cooled are arranged in the inner enclosure frame; the air dryer barrel is filled with an air dryer; the backflow fan is connected with the evaporator and is used for conveying heated air flowing through the electronic element to be cooled into the evaporator again; the inner enclosure frame is a closed type space; and closed air in the inner enclosure frame performs circulation flow in the shape of a Chinese character hui. By repeated circulating flow and refrigeration and dehumidification functions of the evaporator as well as adsorption of the air dryer barrel, the risk of condensed water on the electronic equipment in the closed space is avoided.

Description

technical field [0001] The invention relates to heat dissipation technology for electronic equipment, in particular to a semi-closed electronic equipment miniature cooling system based on compression refrigeration, which can ensure that the short circuit risk of electronic equipment will not be caused by water vapor condensation in an internal low temperature environment. Background technique [0002] Existing heat dissipation technologies for electronic equipment, such as forced air cooling and liquid forced cooling, all use the ambient air as the final heat sink. When used in harsh high-temperature environments such as plateaus, Gobi, deserts, and islands, the ambient air temperature is high, and the electronic components Heat dissipation becomes a problem. [0003] Compression refrigeration can provide a cooling medium lower than the ambient temperature, which can better cool electronic equipment and components. In existing technologies such as CN201010545934.5, electron...

Claims

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Application Information

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IPC IPC(8): F25D21/04F25B1/00H05K7/20
Inventor 祁成武尹本浩王延陈东
Owner SOUTHWEST CHINA RES INST OF ELECTRONICS EQUIP