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PCB dry film circuit digitized film cutting machine

A technology of film cutting and dry film, applied in the field of PCB board manufacturing, can solve problems such as abnormal operation, and achieve the effect of eliminating harmful sewage, fixing firmly, and improving accuracy

Active Publication Date: 2015-12-30
浙江欧威科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0004] At present, although 70%~80% of the state-owned electroplating factories in China have pollution control facilities (generally used to recover copper in the etching solution), most of the treatment facilities have expired and cannot operate normally, and most township electroplating enterprises are almost No pollution control measures are in place

Method used

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  • PCB dry film circuit digitized film cutting machine
  • PCB dry film circuit digitized film cutting machine
  • PCB dry film circuit digitized film cutting machine

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Experimental program
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Embodiment Construction

[0030] Refer to attached picture.

[0031] The PCB dry film circuit digital film cutting machine of the present invention includes a fixed platform 1, a marking positioning device 2, an X-direction moving mechanism 3, a Y-direction moving mechanism 4, a laser film cutting device 5, and a longitudinal adjustment mechanism 6. The fixed platform 1 is installed on the X On the moving mechanism 3, and can reciprocate along the X-direction moving mechanism 3, the Y-direction moving mechanism 4 is erected above the X-direction moving mechanism 3 through the bracket 10 across the X-direction moving mechanism 3, and the laser cutting film device 5 is installed on the On the Y-direction moving mechanism 4, and can reciprocate along the Y-direction moving mechanism 4, the longitudinal adjustment mechanism 6 is arranged on the bottom plate of the laser cutting device 5, and the laser cutting device 5 is provided with a suspension bracket 7 below the suspension bracket 7 A platen mechanism...

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PUM

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Abstract

The invention provides a PCB dry film circuit digitized film cutting machine comprising a fixed platform, a marking positioning device, an X-direction moving mechanism, a Y-direction moving mechanism, a laser film cutting device and a longitudinal adjusting mechanism, wherein the fixed platform does reciprocating motion along the X-direction moving mechanism; the laser film cutting device is arranged on the Y-direction moving mechanism; the longitudinal adjusting mechanism is arranged on a bottom plate of the laser film cutting device; an overhang bracket is arranged below the laser film cutting device and is fixedly provided with a plate pressing mechanism and the marking positioning device; the plate pressing mechanism is provided with a film cutting positioning hole; a laser head of the laser film cutting device penetrates through the film cutting positioning hole to be used for machining a workpiece to be machined. The PCB dry film circuit digitized film cutting machine can achieve three-dimension all-around film carving position adjustment, and the accuracy for film cutting is extremely improved, so that the PCB dry film circuit digitized film cutting machine can be widely applied in machining of various PCBs; generation of hazardous sewage in a production process is avoided, and the discharging of hazardous substances is reduced.

Description

technical field [0001] The invention relates to the field of PCB board manufacturing. Background technique [0002] In recent years, the annual growth rate of my country's electronics industry has exceeded 20%, PCB (printed circuit board) and related industries have developed rapidly, and its output value has ranked third in the world. Some data show that: In the past 20 years, my country's PCB industry has maintained a rapid growth trend. [0003] Etching is an indispensable process for printed circuit boards, metal surface treatment, sign making and other processes in modern electronics industry, decoration industry, advertising industry and other industries. Its function is to quickly and cleanly remove etched copper, aluminum, silicon, Substances such as iron. The current etching process in the PCB industry is generally divided into two categories: dry processing and wet processing, of which wet processing includes more than 20 processes such as roughening, activation,...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B23K26/38B23K26/70B23K26/08B23K37/04B23K101/42
CPCB23K26/083B23K26/0876B23K26/38B23K37/0408B23K2101/42
Inventor 张方德胡扬五阮志平贾中辉张雷
Owner 浙江欧威科技有限公司