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A kind of electroless copper plating solution and a kind of electroless copper plating method

A technology of electroless copper plating and copper salt, which is applied in the direction of liquid chemical plating, metal material coating technology, coating, etc., can solve problems such as overflow plating, achieve high adhesion, high plating speed, relieve overflow The effect of the plating phenomenon

Active Publication Date: 2018-05-08
BYD CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0010] The purpose of the present invention is to overcome the technical problem that overflow plating phenomenon easily occurs in the existing chemical copper plating process, provide a kind of chemical copper plating solution and a kind of chemical copper plating method, adopt this chemical copper plating solution to carry out chemical copper plating, can Effectively alleviate the overflow phenomenon

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0048] (1) Dissolve each component in water according to the composition in Table 1, so as to obtain the electroless copper plating solution of the present invention (pH value is 12.8).

[0049] Table 1

[0050] copper sulfate pentahydrate

[0051] (2) Place the degreased, roughened and activated ABS+PC board in the electroless copper plating solution prepared in step (1) for electroless copper plating to form a copper plating layer with a thickness of 15 μm on the surface of the ABS area. Wherein, the bath temperature is maintained between 50-60°C. After the plating was completed, the plated piece was taken out, and rinsed, and the degree of overflow plating, the plating speed and the adhesion of the formed coating were measured, and the results are listed in Table 2.

Embodiment 2

[0065] Adopt the method identical with embodiment 1 to prepare electroless copper plating solution and carry out electroless copper plating, difference is, the content of 2-mercaptobenzothiazole is 0.002g / L, and the content of dodecyl mercaptan is 0.002g / L . The experimental results are listed in Table 2.

Embodiment 3

[0067] The same method as in Example 1 was used to prepare an electroless copper plating solution and perform electroless copper plating, except that triethanolamine was replaced with an equivalent amount of potassium sodium tartrate, and disodium edetate was replaced with an equivalent amount of sodium citrate. The experimental results are listed in Table 2.

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Abstract

The invention discloses an electroless copper plating solution, which contains a copper salt, a reducing agent, a complexing agent, a pH regulator, an optional stabilizer and an optional surfactant, wherein the chemical The copper plating solution contains 2-mercaptobenzothiazole and R1-SH, wherein R1 is a C8-C14 alkyl group. The present invention also provides an electroless copper plating method, which includes placing the piece to be plated in an electroless copper plating solution for electroless plating, wherein the electroless copper plating solution is the electroless copper plating solution provided by the present invention. The electroless copper plating by using the electroless copper plating solution provided by the invention can effectively alleviate the overflow plating phenomenon. Moreover, using the electroless copper plating solution of the present invention for electroless copper plating can still obtain a higher plating speed, and the formed copper plating layer has higher adhesion to the substrate. Therefore, the electroless copper plating solution of the present invention is particularly suitable for occasions that require copper plating to have a relatively high thickness (for example, more than 12 μm) and relatively high dimensional accuracy.

Description

technical field [0001] The invention relates to an electroless copper plating solution, and also relates to an electroless copper plating method. Background technique [0002] Since Brenner and Ridlell first developed the electroless copper plating technology in the 1940s, after half a century of hard work, this technology has been applied in various fields of the national economy. Electroless copper plating occupies a very important position in electroless plating, and has been widely used in various aspects such as the bottom layer of non-metallic plating, hole metallization of printed boards, and electromagnetic shielding layers of electronic instruments. [0003] Since the birth of electroless copper plating technology, scientists have continuously explored the kinetic process of its heterogeneous surface catalytic deposition; proposed various chemical deposition mechanisms and hypotheses, trying to make a reasonable explanation for the experimental facts of electroless ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C23C18/40
Inventor 韦家亮林宏业
Owner BYD CO LTD