LED bulb lamp and manufacturing method thereof
A technology for LED bulbs and lamp caps, which is applied to lampshades, lighting and heating equipment, cooling/heating devices of lighting devices, etc., can solve the problems of complex assembly of LED bulbs, poor light source performance, and high production costs, and achieve simplification. The effect of cooling the substrate, improving product characteristics, and improving production efficiency
Inactive Publication Date: 2015-12-30
亚浦耳照明股份有限公司
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[0005] In order to solve the problems of complex assembly, high production cost, low efficiency and poor light source performance in the prior art of LED bulb lamps, the present invention provides an LED bulb lamp and a preparation method thereof
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[0053] The following disclosure provides many different embodiments or examples for implementing different structures of the present invention. To simplify the disclosure of the present invention, components and arrangements of specific examples are described below. Furthermore, the present invention may repeat reference numerals and / or letters in different instances. This repetition is for the purpose of simplicity and clarity and does not in itself indicate a relationship between the various embodiments and / or arrangements discussed. It should be noted that components illustrated in the figures are not necessarily drawn to scale. Descriptions of well-known components and processing techniques and processes are omitted herein to avoid unnecessarily limiting the present invention.
[0054] see figure 1 , The LED bulb lamp provided by the present invention includes: a heat dissipation base 50 , a plurality of wafers 20 , a fluorescent gel structure 30 , a power supply 10 , a...
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The invention discloses an LED bulb lamp. The LED bulb lamp comprises a heat dissipation base, a plurality of wafers, a hemisphere structure, a power supply, a burner and a lamp shade, wherein the heat dissipation base comprises a circuit structure; the wafers are connected to the heat dissipation base; the hemisphere structure is used for coating the wafers; the power supply is placed in the heat dissipation base; the burner is located at the bottom of the heat dissipation base and is in electric connection with the heat dissipation base through a wire; the lamp shade is arranged at the top of the heat dissipation base. Correspondingly, the invention further provides a manufacturing method of the LED bulb lamp. According to the LED bulb lamp and the manufacturing method thereof, as the light source and the structural parts are integrated, quick thermal balance can be realized to improve the consistency, the assembly process is simplified, the manufacturing cost is lowered and the production efficiency is improved.
Description
technical field [0001] The invention belongs to the field of lighting lamps, and in particular relates to an LED bulb lamp and a preparation method thereof. Background technique [0002] Because LED lamps have the advantages of long service life, low energy consumption, and energy saving, LED lamps have been widely used in daily life as light sources, such as LED bulb lamps. [0003] LED lighting fixtures are mainly composed of structural parts, power supply, and light source. Among them, the light source is mainly a heat balance structure formed by soldering lamp beads on a circuit board or COB (ChipOnBoard, chip on board) integrated packaging to form a light source of a lamp and pasting heat-conducting silicone grease on a heat sink. Due to the difference in heat conduction caused by the assembly process and component tolerances of the existing LED bulb lamp structure, the consistency of light attenuation of LED lamps is affected; and the thermal resistance of the circuit...
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IPC IPC(8): F21S2/00F21V29/503F21V29/70F21V3/04F21Y101/02
CPCF21S2/00F21V3/12
Inventor 陈兵李星
Owner 亚浦耳照明股份有限公司