System and method for evaluating reliability of thermoelectric element

A technology for evaluating system and reliability, applied in the direction of measuring electricity, measuring electrical variables, testing of single semiconductor devices, etc., can solve the problems of not evaluating the reliability of components, not involving the reliability evaluation method of components, etc., and achieve the evaluation results. Reliable, avoid manual operation errors, save time

Active Publication Date: 2015-12-30
SHANGHAI INST OF CERAMIC CHEM & TECH CHINESE ACAD OF SCI
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  • Abstract
  • Description
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  • Application Information

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Problems solved by technology

[0005] Chinese patent publication CN1975448A discloses a thermoelectric power generation element performance measurement device and method, Chinese patent publication CN1782680A discloses a method for testing thermoelectric conversion efficiency of thermoelectric components, discloses a method for measuring conversion efficiency of thermoelectric components, and Chinese patent Publication CN202421371U discloses a power test experimental device for controlling the temperature of the ...

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  • System and method for evaluating reliability of thermoelectric element
  • System and method for evaluating reliability of thermoelectric element
  • System and method for evaluating reliability of thermoelectric element

Examples

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Embodiment 1

[0090]Example 1: The 1# thermoelectric device sample is used for high and low temperature thermal cycle experiments. The hot end is oscillated between 500°C and 200°C. The thermal cycle period is controlled to be about 30 minutes, and the temperature of the cold end is controlled to be about 15°C. After more than 5,000 cycles After the cycle, analyze its performance changes such as Figure 4 shown. The total open-circuit voltage of thermoelectric elements dropped from 131mV to 129mV, down 1.5%, among which, the open-circuit voltage of P-type elements dropped from 75.7mV to 74.7mV, down 1.3%, and the open-circuit voltage of N-type elements dropped from 55.4mV to 54.4mV, down 1.8% ;The total internal resistance of thermoelectric elements increased from 13.372mOhm to 13.589mOhm, an increase of 1.6%, among which, the internal resistance of P-type components increased from 7.731mOhm to 7.85mOhm, an increase of 1.5%, and the internal resistance of N-type components increased from 5....

Embodiment 2

[0091] Example 2: The 2# thermoelectric device sample is used for the constant temperature differential heat endurance experiment. The hot end is controlled at 530°C, the cold end is controlled at 20°C, and the timing measurement period is 1 hour. After 1000 hours, the performance change is analyzed as shown in the attached Figure 5 shown. The total open-circuit voltage of thermoelectric elements increased from 148.77mV to 150.695mV, an increase of 1.2%, among which, the open-circuit voltage of P-type elements increased from 85.538mV to 86.33mV, an increase of 0.9%, and the open-circuit voltage of N-type elements increased from 63.249mV to 64.381mV, an increase of 1.7%; the total internal resistance of thermoelectric elements increased from 13.78mOhm to 14.725mOhm, an increase of 6.8%, of which, the internal resistance of P-type components increased from 7.992mOhm to 8.567mOhm, an increase of 7.2%, and the internal resistance of N-type components increased from 5.788mOhm to 6....

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Abstract

The invention provides a system and method for evaluating reliability of a thermoelectric element. The system comprises a vacuum device with a vacuum cavity, a sample testing device used for clamping the thermoelectric element to be tested, a hot-end temperature control device used for controlling the temperature of a heat source in the sample testing device, a cold-end temperature control device used for controlling the temperature of a heat sink in the sample testing device, a load device, a multiple-channel data collecting device and a control unit. The sample testing device is located in the vacuum cavity and comprises the heat source and the heat sink, and the thermoelectric element is located between the heat source and the heat sink. The load device and the thermoelectric element constitute a series connection circuit, and the load device controls current output of the thermoelectric element. The multiple-channel data collecting device is connected with the load device as well as the cold side and the hot side of the thermoelectric element so as to collect measurement signals of the thermoelectric element. The control unit is connected with the load device, the multiple-channel data collecting device and the hot-end temperature control device.

Description

technical field [0001] The present invention relates to a system and method for evaluating the reliability of thermoelectric components, and more specifically, to a system and method for performance testing of thermoelectric components and their reliability evaluation under different working conditions. Background technique [0002] Semiconductor thermoelectric technology uses the Seebeck and Peltier effects to realize the mutual conversion between thermal energy and electrical energy. The main applications are thermoelectric power generation and thermoelectric cooling. It is a static energy conversion method. Since thermoelectric power generation has no rotating parts, Therefore, the biggest advantage is long life and high reliability, which has broad application prospects in both civil and military applications; however, the reliability of thermoelectric components, which are the core of thermoelectric power generation, affects the reliability of the entire system to a cert...

Claims

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Application Information

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IPC IPC(8): G01R31/26G01R31/265G01R31/00
Inventor 廖锦城唐云山黄向阳吴汀柏胜强陈立东
Owner SHANGHAI INST OF CERAMIC CHEM & TECH CHINESE ACAD OF SCI
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