Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Preparation process of plug-in type blind hole HDI board

A preparation process and blind hole technology, which is applied in electrical components, multilayer circuit manufacturing, printed circuit manufacturing, etc., can solve problems such as short circuit, error, blind hole open circuit, etc., and achieve the effect of reducing the difficulty of process manufacturing

Active Publication Date: 2016-01-13
SHENZHEN SUNTAK MULTILAYER PCB
View PDF10 Cites 5 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] For this reason, the technical problem to be solved by the present invention is to overcome the certain error in the thickness of the medium after lamination in the prior art, or the bottom of the blind hole is prone to poor tin plating, which may easily lead to insufficient depth of the back drilling, resulting in metallization. The technical bottleneck of open or short-circuited blind holes, thus proposing a preparation process that can control the depth to ensure that blind holes will not be open or short-circuited, and avoid the phenomenon of no copper at the bottom of the hole

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0025] Embodiment 1 This embodiment discloses a preparation process of a plug-in type blind hole HDI board, and the specific steps are as follows:

[0026] Definition: The total number of layers of the PCB board is N (the minimum value of N is 4), and the number of conductive layers of plug-in blind holes is n+1 (n takes a positive integer, n represents the inner layer of the connection, and 1 represents the outer layer), and N>n+1.

[0027] When N=4, n=1

[0028] Layers with plug-in blind holes: material cutting→copper reduction→inner layer drilling→inner layer copper sinking→inner layer board electrical (plating enough copper on the hole and surface copper at one time)→slicing analysis→inner layer graphics→inner layer Layer etching→inner layer AOI→browning→post process;

[0029] The remaining layers that do not need to make blind holes: material cutting → inner layer graphics → inner layer etching → inner layer AOI → browning → post-processing;

[0030] Window opening of ...

Embodiment 2

[0033] Embodiment 2 This embodiment discloses a preparation process of a plug-in type blind hole HDI board, and the specific steps are as follows:

[0034] When N=4, n=2

[0035] Layers with plug-in blind holes: material cutting→copper reduction→inner layer graphics→inner layer etching→inner layer AOI→browning→pressing→inner layer drilling→inner layer copper sinking→inner layer electrical (disposable Plating the hole copper and the surface copper enough)→slice analysis→inner layer graphics→inner layer etching→inner layer AOI→browning→post process;

[0036] Window opening of non-flowing PP sheet: material cutting → non-flowing PP window opening → post-process;

[0037] The process of the outer layer after lamination of the sub-board and the non-flowing glue PP: lamination→outer layer drilling→outer layer copper sinking→full board electroplating→outer layer graphics→graphic electroplating→outer layer alkaline etching→outer layer AOI→silk printing resistance Welding → silk scre...

Embodiment 3

[0039] Embodiment 3 This embodiment discloses a preparation process of a plug-in type blind hole HDI board, and the specific steps are as follows:

[0040] When N>4, n=1

[0041] Layers with plug-in blind holes: material cutting→copper reduction→inner layer drilling→inner layer copper sinking→inner layer board electrical (plating enough copper on the hole and surface copper at one time)→slicing analysis→inner layer graphics→inner layer Layer etching→inner layer AOI→browning→post process;

[0042] The remaining layers that do not need to make blind holes: material cutting → first inner layer pattern → first inner layer etching → first inner layer AOI → browning → pressing → second inner layer pattern → second time Inner layer etching → second inner layer AOI → browning → post process;

[0043] Window opening of non-flowing PP sheet: material cutting → non-flowing PP drilling → post-process;

[0044] Outer layer process after lamination of two sub-boards and non-flowing glue ...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention belongs to the circuit board processing field and relates to a preparation process of a plug-in type blind hole HDI board, wherein the plug-in type blind hole HDI board is composed of an outer-layer plate, an inner-layer plate with through holes and a remaining inner-layer plate without blind holes. The preparation process includes the following steps that: the outer-layer plate, the inner-layer plate with the through holes and the remaining inner-layer plate without blind holes are staked to each other sequentially and are laminated; portions of the outer-layer plate, which are corresponding to the through holes of the inner-layer plate, are drilled so as to form blind holes; and outer-layer electroless plating copper, full-board electroplating, outer-layer patterning, pattern electroplating, outer-layer alkaline etching, solder mask screen printing, character screen printing, surface treatment and subsequent processes are carried out. With the preparation process of the invention adopted, technical problems in depth control can be solved, and blind holes will not bring out open-circuiting or short-circuiting due to depth problems assuredly; and a situation that copper does not cover the bottoms of the holes can be avoided; plug-in blind hole manufacture can be completed through ordinary electroplating solutions; and the electroplating solutions are not needed to be injected to the holes to realize blind hole electroplating, and therefore, manufacture difficulties are lowered, and cost can be reduced.

Description

technical field [0001] The invention belongs to the field of circuit board processing, and in particular relates to a preparation process of a plug-in type blind hole HDI board. Background technique [0002] In the field of circuit boards, in order to achieve more functions on the same PCB, it is necessary to install different soldering types of components on the front and back of the same PCB, and HDI boards with single-sided large-aperture blind holes can It can well meet the requirements of installing different soldering types of components on the same PCB. [0003] The current method of making single-sided large-aperture back-drilled holes is: after the PCB board is laminated, the blind hole is drilled by the method of controlling the depth of the back-drilled hole, and then through-hole copper sinking and hole-filling electroplating, pattern electroplating and outer layer etching Finally, the metallization of the back-drilled holes is completed to form an HDI board wit...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): H05K3/46
CPCH05K3/4611
Inventor 白亚旭苗国厚刘克敢
Owner SHENZHEN SUNTAK MULTILAYER PCB
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com