Reinforced heat dissipation liquid-cooled radiator
A heat sink and heat dissipation liquid technology, applied in the direction of cooling/ventilation/heating transformation, etc., can solve the problems of increasing the flow resistance of the liquid and the volume of the heat sink, prone to hot spots of heating components, and limiting the application of liquid cooling heat sinks, etc., to achieve Increased heat dissipation, improved efficiency, and reduced number of effects
Inactive Publication Date: 2016-01-13
TIANJIN UNIV OF COMMERCE
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Problems solved by technology
Traditional liquid cooling heat dissipation is mainly through processing a large number of heat-conducting ribs with different shapes on the bottom plate of the evaporator, which not only increases the flow resistance of the liquid and the volume of the radiator itself, but also increases the power consumption of the circulating pump, and heat transfer The effect is not good, and hot spots are prone to appear on the surface of heating components, which limits the further application of liquid cooling radiators
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[0018] The present invention will be described in further detail below in conjunction with the accompanying drawings and specific embodiments.
[0019] The schematic diagram of the enhanced heat dissipation liquid cooling radiator of the present invention is as follows Figure 1-Figure 5 As shown, it includes a sealed working chamber composed of a bottom plate 5 and an upper cover 2, the bottom of the upper cover 2 and the bottom plate 5 are fastened by welding or bolts, and the working chamber constitutes a space for circulating cooling medium. Inside the bottom plate 5 is an evaporation chamber 6 . The working chamber is provided with a plurality of cooling units, a plurality of rib columns 8 and a partition 9 parallel to the bottom plate 5, a first flow channel 11 is formed between the partition 9 and the top inner wall of the upper cover 2, A second flow channel 12 is formed between the partition plate 9 and the bottom plate 5, and the first flow channel 11 communicates w...
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Abstract
The invention discloses a reinforced heat dissipation liquid-cooled radiator, and aims to provide a liquid-cooled radiator capable of effectively reducing the flow resistance and increasing the heat dissipating capacity of unit volume. The radiator comprises a sealed working cavity formed by a bottom plate and an upper cover, wherein an evaporation cavity is formed in the bottom plate; a plurality of heat dissipation units, a plurality of rib columns and a division plate parallel to the bottom plate are arranged in the working cavity, a first runner is formed between the division plate and the inner wall of the top of the upper cover, a second runner is formed between the division plate and the bottom plate, the first runner is communicated with the second runner to form a coolant runner, the upper cover opposite to the first runner is provided with a liquid inlet, and the upper cover opposite to the second runner is provided with a liquid outlet; each heat dissipation unit is formed by a heat insulation cavity and a condensation cavity which are communicated with each other, the heat insulation cavity is positioned between the division plate and the bottom plate, and the condensation cavity is positioned at the upper part of the division plate; the lower end of the heat insulation cavity is communicated with the evaporation cavity; and the plurality of rib columns penetrating through the division plate are arranged on the bottom plate. The radiator can effectively maintain the temperature of a cooled device within a safe range, and can be miniaturized.
Description
technical field [0001] The invention relates to the technical field of thermal energy engineering heat dissipation, in particular to a liquid cooling heat dissipation device used for heat dissipation of high heat flux density devices. Background technique [0002] With the increasing integration of electronic components, the heat dissipation of single equipment and the whole machine of high heat flux devices in the fields of electronic product equipment, aerospace, energy and chemical industry has increased sharply, and the cooling problem of high heat flux devices has become a constraint for related fields. The biggest obstacle to a technological leap. The traditional heat dissipation method is mainly based on air cooling, and other heat dissipation methods include liquid cooling, heat pipe heat dissipation, semiconductor refrigeration, and micro refrigeration system cooling. Among them, air cooling and liquid cooling are the most common and cheap cooling methods for high h...
Claims
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Login to View More IPC IPC(8): H05K7/20
Inventor 耿凤彦杨洋陈萨如拉
Owner TIANJIN UNIV OF COMMERCE