Manufacturing method of multilayer printed circuit board
A technology of multi-layer printing and manufacturing method, applied in the direction of multi-layer circuit manufacturing, etc., can solve the problems such as the inability to fully ensure the reliability of the interlayer connection in the temperature cycle test, the large difference in thermal expansion coefficient between liquid crystal polymer and copper, etc.
Active Publication Date: 2019-10-18
NIPPON MEKTRON LTD
View PDF6 Cites 0 Cited by
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
[0005] However, the thermal expansion coefficient in the thickness direction of the liquid crystal polymer is larger than that of insulating materials such as polyimide used in conventional flexible printed circuit boards.
Therefore, it is considered that when using copper-plated through holes, which are generally used for interlayer connection, there is a large difference in the thermal expansion coefficient between liquid crystal polymer and copper, and it is not possible to sufficiently secure layers such as temperature cycle tests. connection reliability
Method used
the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View moreImage
Smart Image Click on the blue labels to locate them in the text.
Smart ImageViewing Examples
Examples
Experimental program
Comparison scheme
Effect test
Embodiment Construction
[0045] The method for producing a multilayer printed circuit board of the present invention is aimed at realizing low-cost and efficient production of a multilayer printed circuit board. The method includes a printing step. The printing squeegee uniformly coats the conductive paste on the circuit substrate, and fills the conductive paste in the conduction holes of the circuit substrate. The manufacturing method of the multilayer printed circuit board is realized in the following manner. The method is as follows: The printing plate includes: a frame body portion having a large opening larger than the circuit base material in a plan view; a resin peripheral portion having a small opening portion smaller than the circuit base material in a plan view and disposed on the large opening portion The lower periphery of the circuit substrate, the printing step includes: positioning the frame body on the circuit substrate in such a way that the small opening covers the periphery of the ci...
the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More PUM
Login to View More Abstract
The object of the present invention provides a method for manufacturing a multi-layer printed circuit board. The printed circuit board (100) comprises a frame body (110). The frame body (110) comprises a large opening part (110a) larger than a circuit substrate (10) from the overlook perspective, a resin peripheral part (120) arranged at the lower peripheral edge of the large opening part (110a), and a small opening part (120a) smaller than the circuit substrate from the overlook perspective. The printing process of the printed circuit board (100) comprises the steps of positioning the frame body (110) and loading the frame body (110) onto the circuit substrate (10) in such a manner that the peripheral edge of the frame body (110) is covered by the small opening part (120a); uniformly applying the conductive paste (P) onto the circuit substrate (10) via the small opening part (120a); filling the conductive paste (P) into a conduction hole (15); and placing the residual conductive paste (P) onto the peripheral part (120) inside the large opening part (110a).
Description
technical field [0001] The present invention relates to a method for manufacturing a multilayer printed circuit board, and in particular the present invention relates to a method for manufacturing a multilayer printed circuit board comprising a printing step in which the periphery of a circuit substrate is covered with a printing plate , Fill the conductive paste into the conduction holes of the circuit substrate by printing the squeegee. Background technique [0002] In recent years, the miniaturization and high performance of electronic equipment have been advancing day by day. Therefore, the demand for higher density of printed circuit boards has gradually increased. Therefore, the high density of printed circuit boards can be achieved by making printed circuit boards from single-sided to double-sided and multi-layer printed boards with more than three layers. [0003] In electronic devices such as notebook computers and smartphones that use multilayer printed circuit bo...
Claims
the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More Application Information
Patent Timeline
Login to View More Patent Type & Authority Patents(China)
IPC IPC(8): H05K3/46
CPCH05K3/46
Inventor 成泽嘉彦
Owner NIPPON MEKTRON LTD