Pulsating heat pipe heat transfer system realizing one-way circular flowing and heat transfer method of pulsating heat pipe heat transfer system

Abstract

The invention discloses a pulsating heat pipe heat transfer system realizing one-way circular flowing and a heat transfer method of the pulsating heat pipe heat transfer system. The pulsating heat pipe heat transfer system comprises a direct-current power supply, an ion traction directional tube and a hollow closed-loop pulsating heat pipe loop, wherein the ion traction directional tube comprises multiple emitting electrodes and collecting electrodes, and the emitting electrodes and the collecting electrodes are staggered and arranged sequentially and are connected in a sealed insulation mode; the emitting electrodes are connected with the positive pole of the direct-current power supply, and the collecting electrodes are connected with the negative pole of the direct-current power supply. A high electric field is formed between the emitting electrodes and the collecting electrodes, and under the action of the high electric field, a gas-state working medium and a liquid-state working medium are dragged through electric fluid power, directionally move in the axial direction of the ion traction directional tube and are pushed to perform one-way circular flowing in the hollow closed-loop pulsating heat pipe loop; accordingly, the gas-state working medium and the liquid-state working medium continuously flow and exchange between an evaporation area and a condensation area, and heat transfer is completed. The system has the advantages of simple and convenient technical means and wide application field, and has positive technical effects and popularization and application value.

Description

Technical field [0001] The invention relates to the field of enhanced heat transfer, in particular to a unidirectional circulating flow pulsating heat pipe heat transfer system and a heat transfer method thereof. Background technique [0002] With the continuous improvement of the miniaturization and integration of electronic manufacturing technology, the amount of heat per unit volume has increased sharply, and the resulting "thermal resistance" problem has become an important factor restricting the development of electronic manufacturing technology. On the one hand, the high integration of electronic components inevitably leads to a sharp increase in the heat per unit volume. Taking a computer CPU as an example, the heat flux density generated during its operation has reached 60-100W / cm 2 , And the heat flux density in semiconductor lasers can even reach 10 3 W / cm 2 Magnitude. On the other hand, the reliability of electronic devices is very sensitive to temperature. Every time ...

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Problems solved by technology

[0003] At present, in the traditional pulsating heat pipe heat transfer device, it is difficult for the working medium to form a stable unidirectional circulation flow in the pulsating heat pipe loop, which greatly reduces the exchange efficiency of the working medium between the evaporation zone and the condensation zone, resulting in poor heat transfer performance of the pulsating heat pipe. Unstable and the heat transfer efficiency is not excellent; in addition, at low power, due to the randomness of the distribution of gaseous and liquid working fluids in the pulsating heat pipe, it is difficult to establish the circulation of the working fluid in the evaporation zone and the condensation zone, resulting in the start-up input of the pulsating heat pipe High power, limited application under low power conditions

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