2-inch chip photoresist peeling basket

A photoresist and flower basket technology, applied in electrical components, semiconductor/solid-state device manufacturing, circuits, etc., can solve problems such as pollution, scratches, and unclean peeling, improve liquid flow space, ensure production efficiency, and improve ultrasonic waves. The effect of the peeling effect

Inactive Publication Date: 2016-02-03
Shandong Huaguang Optoelectronics Co. Ltd.
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0007] Aiming at the deficiencies of existing photoresist stripping technology on chips such as pollution, scratches, and unclean stripping, the present invention provides a 2-inch chip photoresist stripping flower basket, which ensures sufficient liquid flow space during ultrasonic stripping At the same time, it prevents the stripped film filaments from winding and floating in the reagent solution in the limited space between the chips, which will cause contamination and scratches on the chip interface, and also improves the production efficiency of ultrasonic stripping

Method used

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  • 2-inch chip photoresist peeling basket
  • 2-inch chip photoresist peeling basket
  • 2-inch chip photoresist peeling basket

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Embodiment Construction

[0024] Such as figure 1 , figure 2 and image 3 As shown, the 2-inch photoresist stripping flower basket of the present invention includes a flower basket body 3 , a slot unit 2 and a bracket unit 1 . The materials of each part are preferably corrosion-resistant materials such as quartz, glass, and polytetrafluoroethylene.

[0025] The flower basket body 3 is a cuboid with a width of 3 cm and a length of 20 cm, and is made of a material with a diameter of 0.8 cm. Such as figure 1 As shown, the flower basket body 3 is evenly arranged with several ( figure 1 There are 13) card slot units 2, and the distance between adjacent card slot units 2 is 1.5cm. The bottom of the flower basket body 1 is provided with support columns 1-3. There are 4 supporting columns 1-3, which are arranged on the bottom surface of the intersection of the four sides of the flower basket body 1, and are used to support the whole flower basket. The support columns 1-3 are cylinders with a height of ...

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Abstract

Provided is a 2-inch chip photoresist peeling basket which comprises a basket body, clamping groove units, and a support unit. The clamping groove units are arranged on the basket body and each clamping groove unit is provided with two trenches between which a baffle plate for separating the two trenches is disposed. A supporting column is arranged on the bottom of the basket body. The support unit is arranged on the basket body. The peeling faces of two photoresist peeling chips placed in the two trenches are opposite. And the two chips are separated by the baffle plate. The 2-inch chip photoresist peeling basket may effectively enlarge the liquid flowing space of the photoresist peeling faces, prevents a chip interface from being polluted and scratched by winding and wandering of peeled thin films in the reagent solution of the limited space between the chips, prevents a quality problem of uncleaned peeling, effectively improves ultrasonic peeling effect, and improves photoresist peeling quality on the premise that production efficiency is guaranteed.

Description

technical field [0001] The invention relates to a flower basket used for peeling photoresist of a 2-inch chip, belonging to the technical field of semiconductor chip interface cleaning treatment. Background technique [0002] It is common to use photoresist as a mask for ICP, PECVD, metal evaporation and other processes in the semiconductor chip preparation process. Generally, after ICP, PECVD, and metal evaporation, a uniform single-slot flower basket device chip will be used to improve production efficiency. The interval between the card slots is generally small. This will cause the gap between the chips to be small. During ultrasonic or cleaning treatment, the photoresist on the chip and the film that needs to be peeled off from the photoresist do not have enough space to fall off from the chip, resulting in poor stripping of the photoresist. Complete situation; or the photoresist and the film that needs to be peeled off on the photoresist fall off, but cause contaminati...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/673
CPCH01L21/67316
Inventor 刘青徐现刚
Owner Shandong Huaguang Optoelectronics Co. Ltd.
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