Processing method of package substrate

Abstract

The invention provides a processing method of a package substrate. By employing the method, a package substrate can be divided into multiple package devices on the premise that the quality of the package devices is not reduced. According to the method, the package substrate is divided into multiple package devices based on preset diving lines; multiple devices are arranged on the corresponding multiple zones defined by the preset diving lines with latticed shapes on the front surface of a radiating substrate; and the multiple devices are covered with resin. The method comprises a resin removing step and a package device generating step. In the resin removing step, pulse laser light of CO2 laser are emitted along the preset dividing lines on the package substrate, the pulse width of the pulse laser light is less than several microseconds, and the resin covering the multiple devices is removed along the preset dividing lines, so that the front surface of the radiating substrate can be exposed along the preset dividing lines. In the package device generating step, laser light with the wavelength being about 1 [mu]m is emitted along the preset diving lines with the resin being removed, and the radiating substrate is divided along the preset diving lines, so that the package devices are generated.

Description

technical field [0001] The present invention relates to a processing method of a packaging substrate. Devices are respectively arranged on a plurality of regions divided by grid-shaped dividing lines on the front surface of a heat dissipation substrate, and the plurality of areas are divided and covered with a resin layer along the dividing lines. The package substrate of the device. Background technique [0002] Devices such as ICs, LSIs, and LEDs are sometimes used by being disposed on a heat-dissipating substrate called a heat sink in order not to cause a reduction in function due to heat generation. Such a packaged device in which devices are arranged on a heat dissipation substrate is manufactured by dividing a package substrate in which a plurality of devices are arranged on the front surface of the heat dissipation substrate. In addition, the heat dissipation substrate is formed of metal such as stainless steel or copper, and ceramics such as aluminum nitride with hi...

AI Technical Summary

Problems solved by technology

[0007] In addition, when the package substrate is cut along the planned dividing line by a cutting device having a cutting blade, the processing feed rate must be set to a low speed of about 30 mm / sec, and there is a problem of poor productivity.

In addition, if the package substrate is cut along the planned dividing line by a cutting knife, when the heat dissipation substrate is formed of metal, burrs will be generated, and there is a problem of lowering the quality of the package device.

[0008] On the other hand, in the method of cutting the package substrate along the planned dividing line by irradiating laser light along the planned dividing line of the package substrate, there is a problem that the quality of the packaged device is significantly lowered due to melting of the synthetic resin.

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