Piece type OGS touch screen and manufacturing method therefor

A technology of touch screen and manufacturing process, applied in the field of capacitive touch screen, which can solve the problems of low strength of OGS touch screen glass, cumbersome manufacturing process, and difficult shape processing, etc., and achieve the effects of environmental protection, optimization of manufacturing process, and improvement of glass strength

Inactive Publication Date: 2016-02-17
深圳市合力泰光电有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Although the cost-effectiveness of scale is acceptable and can meet the needs of lower-end electronic products, the glass strength of the OGS touch screen is not high, the shape is not easy to process, and the yield rate needs to be improved. Moreover, the manufacturing process is cumbersome, resulting in waste of resources and high production costs. cause environmental problems

Method used

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  • Piece type OGS touch screen and manufacturing method therefor

Examples

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Comparison scheme
Effect test

Embodiment 1

[0050] This embodiment is used to illustrate the OGS touch screen of the present invention and its manufacturing method.

[0051] The manufacturing method of the OGS touch screen of the chip manufacturing process of the present embodiment comprises the following steps:

[0052] (1) Form the ink layer 2 on the transparent substrate 1: divide the transparent substrate 1 (that is, a small piece of chemically strengthened glass substrate) into a window area and a non-window area, and use a 400-mesh screen to print an ink layer on the non-window area of ​​the transparent substrate 1 The laser-resistant black ink with a layer thickness of 4 μm is baked after printing. The baking temperature is 160 ° C and the baking time is 12 minutes. After the first layer of black ink layer is formed, a layer of laser-resistant ink with a thickness of 4 μm is printed. The black ink is baked after printing. The baking temperature is 160°C and the baking time is 12 minutes to form a bottom ink layer...

Embodiment 2

[0058] This embodiment is used to illustrate the OGS touch screen of the present invention and its manufacturing method.

[0059] The manufacturing method of the OGS touch screen of the chip manufacturing process of the present embodiment comprises the following steps:

[0060] (1) Form the ink layer 2 on the transparent substrate 1: Divide the transparent substrate 1 (that is, a small piece of chemically strengthened glass substrate) into a window area and a non-window area, and use a 350-mesh screen to print on the non-window area of ​​the transparent substrate 1 first. High-temperature-resistant white ink with a layer thickness of 6 μm is baked after printing. The baking temperature is 150 ° C and the baking time is 15 minutes. After the first white ink layer is formed, a layer of high-temperature resistant white ink with a thickness of 6 μm is printed. The white ink is baked after printing. The baking temperature is 150°C and the baking time is 15 minutes. After the second...

Embodiment 3

[0066] This embodiment is used to illustrate the OGS touch screen of the present invention and its manufacturing method.

[0067] The manufacturing method of the OGS touch screen of the chip manufacturing process of the present embodiment comprises the following steps:

[0068] (1) Form the ink layer 2 on the transparent substrate 1: Divide the transparent substrate 1 (that is, a small piece of chemically strengthened glass substrate) into a window area and a non-window area, and use a 420-mesh screen to print an ink layer on the non-window area of ​​the transparent substrate 1 High-temperature-resistant red ink with a layer thickness of 5 μm is baked after printing. The baking temperature is 180 ° C and the baking time is 10 minutes. After the first layer of red ink layer is formed, it is printed and baked in the same way. Form four layers of high-temperature-resistant red ink layers with a thickness of 5 μm in sequence, and then print a layer of laser-resistant gray ink with...

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PUM

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Abstract

The present invention discloses a piece type OGS touch screen. The OGS touch screen comprises a transparent substrate (1), an ink layer (2), an ITO electrode layer (3) and an ITO protective layer (4) which are successively stacked. The present invention also provides a manufacturing method for a piece type OGS touch screen. The method comprises: printing ink on a transparent substrate (1) to form an ink layer (2); applying a piece type ITO coating to the ink layer (2), and performing laser dry etching to form an ITO electrode layer (3); and printing ink on the ITO electrode layer(3) to form an ITO protective layer (4). The method provided by the present invention can significantly improve glass strength of the OGS touch screen, and reduce and optimize OGS process steps, thereby reducing production costs, improving the yield rate of the OGS touch screen, and facilitating environmental protection.

Description

technical field [0001] The invention relates to the technical field of capacitive touch screens, in particular to an OGS touch screen with a small chip process and a manufacturing method thereof. Background technique [0002] At present, the production process of OGS (Oneglasssolution Single Glass Solution) glass can be divided into two types: large piece process and small piece process according to the order of coating and cutting. The small piece process refers to cutting and CNC processing a large piece of glass into the shape of OGS glass and then tempering it, and then going through several coating and yellowing processes to form ITO electrode patterns and metal wiring on one side of the glass through two processes, thus forming OGS glass finished products; the large-scale production process is to first strengthen the large-scale glass, through several coating and yellow light processes, and form the OGS glass shape of ITO electrode pattern and metal wiring on one side ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G06F3/044
Inventor 李改
Owner 深圳市合力泰光电有限公司
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