Manufacturing method of electronic components
A technology of electronic components and manufacturing methods, which is applied in the manufacture of electrical components, capacitors, electrolytic capacitors, etc., can solve the problems of high capacity, miniaturization or thinning of electronic components, etc., to improve performance and avoid wetting climb Effect
Active Publication Date: 2017-08-29
MURATA MFG CO LTD
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Problems solved by technology
Therefore, it is difficult to further reduce the size and thickness of electronic components, and it is also difficult to increase the capacity of electronic components such as multilayer ceramic capacitors.
Method used
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Embodiment Construction
[0040] As a first embodiment of the present invention, the description has Figure 4 The manufacturing method of the electronic component 1 with the rectangular parallelepiped component main body 2 shown. In order to manufacture the electronic component 1, the component main body 2 is first prepared.
[0041] On the other hand, a fluid coating material containing a conductive material to be a material of the conductor films 9 and 10 is prepared. As the conductive material, for example, in addition to metal powders such as silver, silver-palladium alloy, and copper, conductive materials such as carbon, conductive ceramics, and conductive polymers can be used.
[0042] In order to form the conductor films 9 and 10, the figure 1 The conductor film forming apparatus 41 is shown.
[0043] refer to figure 1 , The conductor film forming apparatus 41 includes a storage tank 43 that accommodates the coating material 42 described above. The storage tank 43 is connected to a discha...
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The present invention provides a method for forming a conductive film in an electronic component. The method can make it possible to reduce the thickness of the conductive film formed on the electronic component, and at the same time can form a continuous film spanning the first surface and the second surface intersecting on the component body in one fell swoop. Extended conductor film. The element main body (2) and the discharge nozzle (45) that is used to discharge the coating material (42) as the conductor film material are oppositely arranged, and the ejection from the discharge nozzle (45) is caused in the discharge nozzle (45) A coating material (42) charged by applying a voltage between the element body (2). The charged coating material (42) is applied to the element body (2) along the electric force line (53). Thus, the conductor film containing the conductive material is simultaneously formed to extend continuously across at least the first surface and the second surface of the element main body (2). During flight along the electric force line (53), the coating material (42) is repeatedly split due to Coulomb repulsion, which promotes the evaporation of liquid components such as solvents and solvents in the coating material (42).
Description
technical field [0001] The present invention relates to a method of manufacturing an electronic component, and in particular to a method of forming a conductive film on the surface of a component body included in the electronic component. Background technique [0002] An electronic component generally includes a component body and a conductor film formed on the component body. The conductive film serves as a terminal electrode, or as an electrode for extracting the electrical characteristics possessed by the element main body, or both. In addition, the element main body has various shapes such as a rectangular parallelepiped, a disk, a sheet, and the like. In addition, the conductor film formed on the element body is usually formed to extend continuously across at least two intersecting faces on the element body. [0003] To be more specific, it is Figure 4 An electronic component 1 having a cuboid component body 2 is shown. The element body 2 has two opposite main faces...
Claims
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IPC IPC(8): B05D1/04B05D5/12B05D7/00H01G4/12H01G9/00
CPCH01G9/04H01G13/00H01G4/005H01G9/0029H01G4/12
Inventor 横仓修
Owner MURATA MFG CO LTD