Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

EMI noise source impedance equivalent parameter extraction method based on scattering parameter and intelligent algorithm

A technology of scattering parameters and intelligent algorithms, which is applied in gene models, electromagnetic field characteristics, etc., to achieve the effects of simplifying instruments, reducing hardware errors, and setting control parameters easily

Inactive Publication Date: 2016-02-24
JIANGSU INST OF METROLOGY
View PDF3 Cites 14 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] The technical problem to be solved by the present invention is to overcome the defects of the existing measurement methods, and propose a relatively complete method for extracting the source impedance of conducted EMI noise

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • EMI noise source impedance equivalent parameter extraction method based on scattering parameter and intelligent algorithm
  • EMI noise source impedance equivalent parameter extraction method based on scattering parameter and intelligent algorithm
  • EMI noise source impedance equivalent parameter extraction method based on scattering parameter and intelligent algorithm

Examples

Experimental program
Comparison scheme
Effect test

Embodiment

[0106] In the following, the present invention will be further described in detail in conjunction with specific embodiments, using a certain artificial power supply network as a noise source.

[0107] The first step: as attached figure 1 As shown, the artificial power network noise source, injection probe and detection probe (ZN23101 current probe of Beijing Daze Technology Co., Ltd.), vector network analyzer (9kHz-3GHz, ZNC3 type of German Rohde Schwarz R&S Company) , to form a closed circuit.

[0108] Step 2: In figure 1 In the closed circuit, remove the power network under test and replace it with a short-circuit wire, turn on the VNA to measure the reflection coefficient and transmission coefficient in the S parameters, use the marker function to set a series of frequency points (0.15MHz, 0.30MHz...30.00MHz ) to get the amplitude and phase of the corresponding frequency points, such as Figure 5 , Figure 6 shown, and recorded as

[0109] Step 3: Use the AV2782 prec...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention discloses an EMI noise source impedance equivalent parameter extraction method based on scattering parameters and an intelligent algorithm. The EMI noise source impedance equivalent parameter extraction method is based on a scattering parameter principle, adopts a vector network analyzer and two current probes, respectively measures transmission parameters and reflection parameters when in short circuit, loading standard resistance and loading noise source impedance, calculates to obtain the impedance of a measured noise source, carries out optimizing processing on amplitude-frequency and phase-frequency characteristics of the measured impedance by utilizing a GA algorithm in the intelligent algorithm to obtain equivalent RLC parameters of the impedance, and provides general expression of amplitude value and phase position of the impedance. The EMI noise source impedance equivalent parameter extraction method is simple in instrument, does not need to use an auxiliary module, reduces hardware error caused by auxiliary modules such as a signal source and a frequency spectrograph, estimates parameters by using the GA algorithm, avoids the problem that initial values of parameters need to be given when methods such as the Newton-Gauss method and Marquardt method are adopted, increases measuring precision, and provides an accurate reference basis for the design of an EMI filter.

Description

technical field [0001] The invention belongs to the technical field of electromagnetic compatibility, and specifically refers to a method for extracting the equivalent parameters of the noise source impedance of conducted electromagnetic interference (Electromagnetic Interference, EMI) by using the scattering parameter (S parameter) method and the genetic algorithm (Genetic Algorithm, GA) in the intelligent algorithm. . Background technique [0002] In recent years, with the widespread use of high-frequency power electronic devices and large-scale integrated circuit chips in electronic equipment, high-frequency noise generated by them is transmitted to the power grid through the power port, making the EMI problem on the power line more and more serious, affecting the stability of the power grid and other The normal operation of electronic equipment; at the same time, the high-frequency noise will also spread to space in the form of electromagnetic field, causing electromagne...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): G01R29/08G06N3/12
Inventor 赵波闫景瑞马宇明赵敏
Owner JIANGSU INST OF METROLOGY
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com