Double-face welding method preventing big chip from falling off

Abstract

The invention discloses a double-face welding method preventing a big chip from falling off, belonging to the electronic member welding technology field. The double-face welding method comprises steps of (1) performing surface pre-processing, (2) welding a driving surface, (3) reinforcing a BGA chip, (4) welding a luminescence face, (5) welding a metal shielding housing, and (6) adhering a heat radiation sheet. The double-face welding method disclosed by the invention realizes reliable welding of double faces through welding temperature difference and can effectively prevent the BGA chip from falling off through reinforcing the BGA chip. The invention is good in the effect, and cannot cause BGA chip to fall off even that the shielding housing, the heat radiation sheets are added on the outside of the BGA chip.

Description

technical field [0001] The invention relates to a welding method for electronic components on a printed circuit board, in particular to a double-sided welding method for preventing large chips from falling off, and belongs to the technical field of electronic component welding. Background technique [0002] Display technology is changing with each passing day, picture quality is gradually improving, and display products are gradually becoming integrated and standardized. On the one hand, the receiving and storage part of the control card is designed in the display driver part; on the other hand, the voltage is increased and the current is reduced to meet the needs of various safety certifications. Therefore, the driving surface of the display module needs to add BGA-packaged chips. The display module needs to be welded on the front and back sides. Usually, the driving surface is welded first, and then the light-emitting tube part is welded. The reason is that the light-emit...

AI Technical Summary

Problems solved by technology

The display module needs to be welded on the front and back sides. Usually, the driving surface is welded first, and then the light-emitting tube part is welded. The reason is that the light-emitting tube cannot be reflowed twice. It is impossible to mount other chips on the display light-emitting surface except for the light-emitting tube.

Therefore, when the driving surface is mounted and the luminous tube is mounted upside down, the BGA package chip with a large self-weight will fall due to the influence of gravity, resulting in poor soldering

Due to the particularity of BGA packaging, product maintenance is more difficult, so if this problem is not solved, the production efficiency and output ratio will be greatly reduced

Of course, we can choose to solder the BGA-packaged chips on other printed boards and connect them through pins, but this method will increase the variety of products, reduce the reliability of the products, and increase the risk of the products

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