A sealing butt joint device

Abstract

The invention discloses a sealing docking device, which is used for the sealing docking of a first device and a second device, and is characterized in that it includes a rotating handle arranged on a mounting bracket, two sets of crank slider series components, a steel wire rope, and a sealing chamber enclosure and elastic components, each set of slider crank assemblies includes a first slider crank mechanism, and two sets of slider crank assemblies are connected through a rotating handle, the rotating handle and two sets of slider crank assemblies are located on one side of the mounting bracket, and the sealed cavity is surrounded by The plate is located inside the mounting bracket, one end of the wire rope is fixed on the first slider crank mechanism, and the other end is connected to the elastic component, and the first crank slider mechanism moves by rotating the rotating handle to change the tension of the wire rope on the elastic component, thereby controlling The sealing chamber coaming board extends or retracts from the other side of the mounting bracket, so that the first device and the second device on both sides of the sealing chamber coaming board are sealed butted through the sealing chamber coaming board.

Description

technical field [0001] The invention relates to the field of integrated circuit equipment manufacturing, in particular to a sealing butt joint device. Background technique [0002] In the semiconductor manufacturing process, the formation of chips often requires dozens of processes to be finally completed. In general, different processes require different equipment for processing, therefore, the formation of a chip requires many different equipment to complete. Multi-channel processes are carried out on silicon wafers to finally form the required chips, and silicon wafers have very high requirements on the external environment, especially when silicon wafers are exchanged between different devices, silicon wafers are often exposed outside the equipment environment, so , It is required that the environment of the exchange space between different devices must be kept good, and the environmental parameters include temperature, pressure, air cleanliness, etc. [0003] In the p...

AI Technical Summary

Problems solved by technology

In addition, due to the possibility of installation errors during the installation of two large-scale equipment, how to compensate for installation errors in the process of docking two large-scale equipment has become an urgent problem to be solved

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