Method for electroplating copper and sliver on iron-nickel alloy frame

Abstract

The present invention discloses a method for electroplating copper and sliver on an iron-nickel alloy frame. The method is characterized by comprising: 1, fixing an iron-nickel alloy frame; 2, carrying out cathode-anode combined degreasing; 3, carrying out acid washing; 4, carrying out cyanogen neutralization; 5, pre-plating copper; 6, plating copper; 7, pre-plating silver; 8, plating silver; 9, deplating sliver; 10, carrying out copper protection; and 11, drying, and taking the iron-nickel alloy frame from the bracket so as to complete the electroplating process. According to the present invention, the method has advantages of good electroplating effect and low cost.

Description

technical field [0001] The invention relates to a manufacturing method of a lead frame, in particular to a method for electroplating copper and silver on an iron-nickel alloy frame. Background technique [0002] With the development of science and technology, the production and demand of digital products are increasing day by day, the demand for semiconductor electronic components is increasing day by day, and they tend to be miniaturized. It will cause defects such as insufficient strength, low production efficiency, and difficulty in improving traction during the production process. Manufacturers generally use iron-nickel alloys as raw materials to produce lead frames. In order to enhance their conductivity, most of them use copper or silver plating. However, the conductivity of pure copper plating is not as good as that of silver plating. In order to ensure its conductivity, pure silver plating needs to be plated thicker, and the expenditure will be more, which does not m...

AI Technical Summary

Problems solved by technology

[0002] With the development of science and technology, the production and demand of digital products are increasing day by day, the demand for semiconductor electronic components is increasing day by day, and they tend to be miniaturized. It will cause defects such as insufficient strength, low production efficiency, and difficulty in improving traction during the production process. Manufacturers generally use iron-nickel alloys as raw materials to produce lead frames. In order to enhance their conductivity, most of them use copper or silver plating.

However, the conductivity of pure copper plating is not as good as that of silver plating. In order to ensure its conductivity, pure silver plating needs to be plated thicker, and the expenditure will be more, which does not meet the economic benefits of investment and income.

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