Production and separation method for flexible substrate
A technology of flexible substrates and separation methods, which is applied in semiconductor/solid-state device manufacturing, electrical components, electric solid-state devices, etc., can solve the problems of unsatisfactory yield and quality of flexible substrates, high cost of flexible OLED preparation, and achieve supporting facilities Improvement, wide application range, and the effect of reducing equipment procurement costs and process costs
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[0024] Example one:
[0025] In this embodiment, see Figure 1~3 , A method for preparing and separating flexible substrates, using a rigid material base 1, and a rigid material base 1 using a glass base. On the rigid material base 1, a grid-like continuous frame layer 2, a connecting layer 3 and a flexible substrate are sequentially prepared 4. A grid-like layout is formed. Between the rigid material base 1 and the flexible substrate 4, the connecting layer 3 and the continuous frame layer 2 are combined to form a combined layer, and the material for preparing the connecting layer 3 is filled into the continuous frame layer 2, the upper surface of the composite layer is used as the surface of the carrier substrate for preparing the flexible substrate 4, and then the flexible substrate 4 is prepared on the upper surface of the composite layer, and then the subsequent film layer preparation is performed on the flexible substrate 4. The frame layer 2 remains stable during the prep...
Example Embodiment
[0033] Embodiment two:
[0034] This embodiment is basically the same as the first embodiment, and the special features are:
[0035] In this embodiment, when the flexible substrate 4 is separated, the material of the continuous frame layer 2 is decomposed by the UV irradiation method, so that a grid-like continuous channel 5 is formed in the combined layer to facilitate the subsequent implementation of the connection layer 3 Etching and removal process. The method of this embodiment adopts the preparation of a combined layer composed of a connection layer 3 and a grid-like continuous frame layer 2 between the glass substrate and the flexible substrate 4, wherein the continuous frame layer 2 is stable under the subsequent film preparation conditions, and in a specific treatment Under decomposition, the continuous frame layer 2 is decomposed and the morphology is changed by changing the UV irradiation reaction conditions, and the grid-like continuous channels 5 are formed in the ...
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