Chip packaging structure and method
A chip packaging structure and chip packaging technology, applied in electrical components, electrical solid devices, circuits, etc., can solve the problems of light waste, side light leakage of packaged finished products, low production efficiency, etc., to increase mechanical strength, simplify packaging process, improve The effect of production efficiency
Active Publication Date: 2017-09-26
HUATIAN TECH KUNSHAN ELECTRONICS
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Problems solved by technology
[0002] The current package form of LED chips is usually carried out in a single form, that is, the cut LED chips are mounted one by one on the substrate (such as metal bracket, lead frame, ceramic substrate, metal substrate), and then the metal leads are interconnected one by one. Dispensing glue one by one; since almost all processes are carried out with a single piece, the production efficiency is relatively low and the production cost is high, which seriously restricts the application of LED
Moreover, the side of the finished package formed by this single-chip package leaks light, resulting in different degrees of light waste
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[0047] In order to make the present invention more comprehensible, the specific implementation manners of the present invention will be described in detail below in conjunction with the accompanying drawings. For convenience of description, the components in the structures in the drawings of the embodiments are not scaled according to the normal scale, so they do not represent the actual relative sizes of the structures in the embodiments. The above or upper side of the structure or surface includes the case where there are other layers in the middle.
[0048] Such as Figure 1a-Figure 1k Shown, a kind of chip packaging method comprises the following steps:
[0049] A. see Figure 1a with Figure 1b , providing a first substrate, the first substrate has a plurality of first substrate units 1 corresponding to a plurality of chips to be packaged, the first substrate unit has a first surface 101 and an opposite second surface 102, in the first The second surface 102 of the su...
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The invention discloses a chip packaging structure and method. The packaging structure adopts two substrates for bonding and packaging, which increases the mechanical strength of the packaging structure. The inclined side wall of the groove reflects the light leaked from the side of the LED, which improves the light efficiency; the filling groove is set on the substrate corresponding to the position of the metal wiring on the other substrate for back interconnection, and filled with insulating material, which facilitates the The electrical properties of the chip are led to the back of another substrate, which simplifies the packaging process. The manufacturing method is wafer-level packaging, that is, several chips are respectively placed in several accommodating grooves, subsequent packaging is completed, and finally individual chips are cut. Wafer-level packaging improves production efficiency.
Description
technical field [0001] The invention relates to a semiconductor chip package, in particular to a chip package structure and method. Background technique [0002] The current packaging form of LED chips is usually carried out in a single form, that is, the cut LED chips are mounted one by one on the substrate (such as metal bracket, lead frame, ceramic substrate, metal substrate), and then the metal leads are interconnected one by one. Dispensing glue one by one; since almost all processes are carried out on a single piece, the production efficiency is relatively low and the production cost is high, which seriously restricts the application of LEDs. Moreover, light leaks from the side of the packaged product formed by this single-chip package, resulting in waste of light to varying degrees. The mechanical strength and functional application of the LED chip packaging structure need to be further improved. Contents of the invention [0003] In order to solve the above techn...
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IPC IPC(8): H01L33/52H01L33/60H01L33/62
CPCH01L2224/16225H01L2224/97
Inventor 肖智轶沈建树翟玲玲
Owner HUATIAN TECH KUNSHAN ELECTRONICS