Laser micro-pore drilling device and method applicable to hard-brittle substrate

Abstract

The invention discloses a laser micro-pore drilling device applicable to a hard-brittle substrate. The device comprises a laser head, a laser beam transmission device, an 1 / 4 wave plate, a driving device, an 1 / 2 wave plate, a first reflector, a two-dimensional galvanometer, a field lens and a stage, wherein the 1 / 2 wave plate is arranged on the driving device; a laser guide hole is formed in the driving device; the 1 / 2 wave plate is driven by the driving device to rotate; the laser outgoing surface of the 1 / 2 wave plate is a vertical surface; after the laser polarization property of a laser beam emitted by the laser beam transmission device is adjusted through the 1 / 4 wave plate, and the laser polarization direction is adjusted through the driving device and the 1 / 2 wave plate; the laser beam emitted by the 1 / 2 wave plate enters the two-dimensional galvanometer through the first reflector, then emitted to a hard-brittle material through the field lens and finally scanned by the two-dimensional galvanometer to form a preset through hole in the hard-brittle substrate. With the adoption of the device, the polarization property of the laser can be changed, and the polarization direction of the laser can be changed in real time, so that the laser intensity distribution can be improved, a conical slot can be formed, and as a result, the drilling quality and drilling rate can be improved.

Description

technical field [0001] The invention relates to laser processing equipment, in particular to a laser drilling microhole equipment and method suitable for hard and brittle substrates. Background technique [0002] Laser drilling is the earliest practical laser processing technology, and it is also one of the main application fields of laser processing. With the rapid development of modern industry and science and technology, more and more materials with high hardness and high melting point are used, and customers have higher and higher technical requirements for material processing, while traditional processing methods can no longer meet certain process requirements. For example, drilling micron-level small holes on hard and brittle materials is difficult, sometimes even impossible, with conventional mechanical processing methods, but it is not difficult to achieve with laser drilling. [0003] The basic principle of laser processing is to focus the laser on the surface of t...

AI Technical Summary

Problems solved by technology

However, the high price of this type of laser not only greatly increases the operating cost of the equipment, but also makes the functional usability of some laser manufacturers become single, which greatly reduces the effective utilization rate of the equipment.

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