Ultrasonic testing system for defects of monocrystalline silicon sticks

Abstract

The invention discloses an ultrasonic testing system for defects of monocrystalline silicon sticks. Two receiving and transmitting integrated ultrasonic probes and two ultrasonic receiving probes are installed on the left and right sides and the front and back sides of a rotatable barrel respectively. A horizontal sliding rail and a vertical sliding rail which are perpendicular are arranged on the inner bottom face of the rotatable barrel. Clamping blocks with servo devices are arranged on both the horizontal sliding rail and the vertical sliding rail in a sliding mode. The receiving and transmitting integrated ultrasonic probes and the ultrasonic receiving probes are all connected with the upper ends of fixing supports through electric telescopic rods. The ultrasonic testing system further comprises a data receiving and processing module, a human-machine operation module, a three-dimensional model building module, a virtual actuator, a virtual sensor and a transfer node module. According to the ultrasonic testing system, multiscale decomposition and reconstruction are performed on received ultrasonic echo data through dual-tree complex wavelets, and accordingly, testing precision is improved, dynamic three-dimensional monocrystalline silicon sticks can be generated in the testing process, and the testing precision is further improved.

Description

technical field [0001] The invention belongs to the technical field of measuring instruments and is used for non-destructive detection of single crystal silicon defects, and relates to an ultrasonic detection system for single crystal silicon rod defects, and also relates to an ultrasonic detection method for single crystal silicon rod defects. Background technique [0002] Single crystal silicon defect is the destruction of the periodic symmetry of the crystal, which makes the actual crystal deviate from the crystal structure of the ideal crystal. The types of point, diameter, line, surface and body defects are manifested as inclusions, bubbles, cavities, etc., which are caused by the influence of some accidental factors such as temperature and vibration during the preparation process. Defects have an important impact on the slicing process. Commonly, they damage production equipment, reduce production efficiency, and cause uneven product quality. Its detection method stil...

AI Technical Summary

Problems solved by technology

The peripheral part of the ultrasonic beam will be reflected outwards due to the boundary arc of the single crystal silicon rod, and may be repeatedly reflected in the peripheral gap between the probe and the single crystal silicon rod, which will cause difficulties in identifying the waveform and increase the difficulty of defect detection.

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