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Adhesive, FPC protective film using the adhesive and preparation method thereof

A technology for adhesives and protective films, applied in the direction of adhesive additives, polymer adhesive additives, non-polymer adhesive additives, etc., can solve problems such as uneven bonding, reduced production efficiency, and poor operability , to achieve good wetting and adsorption, overcome the problem of air bubbles, and enhance the effect of operability

Active Publication Date: 2017-09-19
NINGBO SOKEN CHEM
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0003] There are many types of existing FPC protective films, but there are generally the following problems: First, when the FPC protective film is bonded to the FPC board, due to the stickiness of the glue surface, it is easy to cause damage to the protective film with high viscosity by manual lamination. Problems such as uneven lamination and bubbles will lead to the scrapping of products, especially for those very thin protective films, which have extremely poor operability; however, even if the above problems can be solved by automatic lamination machines, but in The bubble problem caused by the partial separation of the protective film and the FPC board will also occur in the subsequent high-temperature pressing, which will not only increase the production cost, but also reduce the production efficiency accordingly

Method used

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  • Adhesive, FPC protective film using the adhesive and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0024] In this embodiment, the substrate layer adopts polyimide film with a thickness of 50 μm, and the thickness of the adhesive layer is 9 μm. The adhesive used for the adhesive layer consists of the following components and their parts by mass: acrylate adhesive 100 parts of adhesive SK-1499M (manufactured by Zongyan Chemical Co., Ltd., Ningbo Daxie Development Zone, the same below), 1 part of toluene diisocyanate, and 3 parts of isopropyl palmitate.

[0025] The preparation process of the FPC protective film in this example is as follows: 100 parts of the above-mentioned acrylate adhesive SK-1499M, 1 part of toluene diisocyanate and 3 parts of isopropyl palmitate were mixed and stirred evenly to form an adhesive composition, The adhesive composition was evenly coated on the substrate layer with a coating thickness of 9 μm, dried and cured at 125° C. for 3 minutes to form an adhesive layer, and then a release film was laminated on the adhesive layer. Cut into the FPC protec...

Embodiment 2

[0027] In this embodiment, the substrate layer adopts polyimide film with a thickness of 13 μm, and the thickness of the adhesive layer is 10 μm. The adhesive used for the adhesive layer consists of the following components and their parts by mass: acrylate adhesive 100 parts of adhesive SK-1499M, 1 part of toluene diisocyanate, 5 parts of isopropyl palmitate.

[0028] The preparation process of the FPC protective film in this example is as follows: 100 parts of the above-mentioned acrylate adhesive SK-1499M, 1 part of toluene diisocyanate and 5 parts of isopropyl palmitate were mixed and stirred evenly to form an adhesive composition, The adhesive composition was evenly coated on the substrate layer with a coating thickness of 10 μm, dried and cured at 130°C for 2 minutes to form an adhesive layer, and then a release film was coated on the adhesive layer, and separated Cut into the FPC protective film.

Embodiment 3

[0030] In this embodiment, the substrate layer adopts polyimide film with a thickness of 50 μm, and the thickness of the adhesive layer is 11 μm. The adhesive used for the adhesive layer consists of the following components and their parts by mass: acrylate adhesive Adhesive SK-1499M 100 parts, toluene diisocyanate 1 part, alkylphenol polyoxyethylene ether 8 parts.

[0031] The preparation process of the FPC protective film in this example is as follows: 100 parts of the above-mentioned acrylate adhesive SK-1499M, 1 part of toluene diisocyanate and 8 parts of alkylphenol polyoxyethylene ether are mixed and stirred evenly to form an adhesive composition , apply the adhesive composition evenly on the substrate layer with a coating thickness of 11 μm, dry and solidify at 130° C. for 2 minutes to form an adhesive layer, and then cover the release film on the adhesive layer. Slitting to make the FPC protective film.

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Abstract

The invention relates to an adhesive which is composed of the following components in parts by mass: 100 parts of acrylate adhesive, 1-2 parts of crosslinking agent and 3-8 parts of assistant. The adhesive force of the acrylate adhesive for a FPC board is 12-20 gf / 25mm; and the assistant is a non-ionic surfactant. The invention also relates to an FPC protective film using the adhesive and a preparation method thereof. By adding the assistant into the adhesive, the FPC protective film using the adhesive as the adhesive layer obtains the characteristics of ultralow viscosity and no bubble under high-temperature press fitting, so that the protective film has the advantages of higher operability and higher yield when being attached to the FPC, thereby lowering the production cost and enhancing the production efficiency.

Description

technical field [0001] The invention relates to the field of protective films, in particular to a low-viscosity, high-temperature pressure-bonded adhesive without air bubbles, and an FPC protective film using the adhesive and a preparation method. Background technique [0002] Flexible printed circuit board (FPC) has the characteristics of flexibility and reduced volume, which can meet the requirements of short, small, thin and light electronic products, so it is widely used in the field of electronic products, such as communication equipment, digital cameras and video cameras, automotive electronics , LCD image display, etc., usually the FPC needs to be covered with a protective film to protect the copper surface. [0003] There are many types of existing FPC protective films, but there are generally the following problems: First, when the FPC protective film is bonded to the FPC board, due to the stickiness of the glue surface, it is easy to cause damage to the protective ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C09J133/08C09J11/06C09J11/08H05K1/03
CPCC08K5/101C08K5/29C08L2203/16C09J11/06C09J11/08C09J133/08H05K1/0346C08L71/02
Inventor 周靖陆建贤王旭辉
Owner NINGBO SOKEN CHEM