Adhesive, FPC protective film using the adhesive and preparation method thereof
A technology for adhesives and protective films, applied in the direction of adhesive additives, polymer adhesive additives, non-polymer adhesive additives, etc., can solve problems such as uneven bonding, reduced production efficiency, and poor operability , to achieve good wetting and adsorption, overcome the problem of air bubbles, and enhance the effect of operability
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Embodiment 1
[0024] In this embodiment, the substrate layer adopts polyimide film with a thickness of 50 μm, and the thickness of the adhesive layer is 9 μm. The adhesive used for the adhesive layer consists of the following components and their parts by mass: acrylate adhesive 100 parts of adhesive SK-1499M (manufactured by Zongyan Chemical Co., Ltd., Ningbo Daxie Development Zone, the same below), 1 part of toluene diisocyanate, and 3 parts of isopropyl palmitate.
[0025] The preparation process of the FPC protective film in this example is as follows: 100 parts of the above-mentioned acrylate adhesive SK-1499M, 1 part of toluene diisocyanate and 3 parts of isopropyl palmitate were mixed and stirred evenly to form an adhesive composition, The adhesive composition was evenly coated on the substrate layer with a coating thickness of 9 μm, dried and cured at 125° C. for 3 minutes to form an adhesive layer, and then a release film was laminated on the adhesive layer. Cut into the FPC protec...
Embodiment 2
[0027] In this embodiment, the substrate layer adopts polyimide film with a thickness of 13 μm, and the thickness of the adhesive layer is 10 μm. The adhesive used for the adhesive layer consists of the following components and their parts by mass: acrylate adhesive 100 parts of adhesive SK-1499M, 1 part of toluene diisocyanate, 5 parts of isopropyl palmitate.
[0028] The preparation process of the FPC protective film in this example is as follows: 100 parts of the above-mentioned acrylate adhesive SK-1499M, 1 part of toluene diisocyanate and 5 parts of isopropyl palmitate were mixed and stirred evenly to form an adhesive composition, The adhesive composition was evenly coated on the substrate layer with a coating thickness of 10 μm, dried and cured at 130°C for 2 minutes to form an adhesive layer, and then a release film was coated on the adhesive layer, and separated Cut into the FPC protective film.
Embodiment 3
[0030] In this embodiment, the substrate layer adopts polyimide film with a thickness of 50 μm, and the thickness of the adhesive layer is 11 μm. The adhesive used for the adhesive layer consists of the following components and their parts by mass: acrylate adhesive Adhesive SK-1499M 100 parts, toluene diisocyanate 1 part, alkylphenol polyoxyethylene ether 8 parts.
[0031] The preparation process of the FPC protective film in this example is as follows: 100 parts of the above-mentioned acrylate adhesive SK-1499M, 1 part of toluene diisocyanate and 8 parts of alkylphenol polyoxyethylene ether are mixed and stirred evenly to form an adhesive composition , apply the adhesive composition evenly on the substrate layer with a coating thickness of 11 μm, dry and solidify at 130° C. for 2 minutes to form an adhesive layer, and then cover the release film on the adhesive layer. Slitting to make the FPC protective film.
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Abstract
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