A fingerprint chip package structure and manufacturing method with spacer and bottom filling
A bottom filling and fingerprint chip technology, which is applied in semiconductor/solid-state device manufacturing, semiconductor/solid-state device components, semiconductor devices, etc., can solve problems such as poor fingerprint sensing imaging effect, mounting tilt, material waste, etc., and achieve high leveling Accuracy, Enhanced Sensitivity, Enhanced Recognition Effect
Active Publication Date: 2019-10-25
HUATIAN TECH XIAN
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Problems solved by technology
However, this method also has the following problems: both the chip and the protective cover need to use soft adhesive materials, and abnormalities such as the inclination of the protective cover and the inclination of the fingerprint sensor chip will inevitably occur, and these abnormalities will lead to fingerprints. Poor sensing imaging effect and low yield
However, the price of high dielectric constant molding compound is much higher than that of traditional molding compound, and for the fingerprint sensor chip, the place where the dielectric constant is relatively strict is mainly in the sensing area (that is, between the sensing area and the protective cover. space), other places do not need high dielectric constant, for the existing packaging structure, there is a problem of material waste
[0006] In order to solve the above problems of flatness, mounting tilt, and material waste, it is necessary to find new solutions, optimize packaging solutions, and save costs
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[0049] The present invention will be further described below in conjunction with specific drawings.
[0050] Such as figure 1As shown, a fingerprint chip packaging structure with pads and underfill, the structure includes a substrate 1, the upper surface of the substrate 1 has a gold finger 2 for wiring, and the fingerprint sensor chip 3 is bonded by an adhesive 8. Connected to the substrate 1, the signal of the fingerprint sensing chip 3 is interconnected with the golden finger 2 through the bonding wire 4 to form a path, and the upper surface of the fingerprint sensing chip 3 is bonded with a protective cover 6 with a pad 5, the pad There is at least one block 5 , and the level of the pads 5 is the same, and the fingerprint sensing chip 3 and the protective cover 6 are bonded by an adhesive 7 . High dielectric constant material 9 is filled between the fingerprint sensor chip 3 and the protective cover plate 6. In the structure, the fingerprint sensor chip 3, the spacer 5, t...
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The invention discloses a fingerprint chip packaging structure and a manufacturing method with pads and bottom filling. The structure includes: at least one substrate, at least one fingerprint sensor chip is placed on the substrate, the fingerprint sensor chip and the substrate are bonded together through a medium layer, the welding pad of the fingerprint sensor chip faces upward, and there is at least one key The wires are interconnected with the substrate. While ensuring the high flatness of the fingerprint chip, the present invention maximizes the sensitivity of fingerprint identification and enhances the identification effect; at the same time, in the process of bare core plastic packaging, the cost of plastic packaging is saved to the greatest extent, and the fingerprint identification chip module is saved. The process of assembling and affixing the protective cover. Optimize the production process of the fingerprint identification system to save costs.
Description
technical field [0001] The invention relates to a fingerprint chip packaging structure and a manufacturing method with pads and bottom filling, and belongs to the technical field of semiconductor packaging. Background technique [0002] In recent years, with the continuous advancement of semiconductor technology and market demand, the rapid development of chip packaging technology, and the continuous emergence of new fingerprint identification systems, especially in the fields of mobile phones, computers, access control, attendance and other confidential systems, etc. Various fingerprint recognition systems have been developed. [0003] At present, mainstream fingerprint identification technologies in the market include: optical fingerprint identification, capacitive fingerprint identification, etc. Among them, the optical fingerprint recognition technology is the earliest developed and widely used at low price, but it has defects such as large size and poor recognition eff...
Claims
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IPC IPC(8): H01L23/10H01L21/50H01L21/58
CPCH01L2224/48091H01L2224/73265H01L2924/181H01L2924/00012H01L2924/00014
Inventor 李涛涛于大全
Owner HUATIAN TECH XIAN