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Electromagnetic shielding heat conducting composition and electromagnetic shielding heat conducting gasket

An electromagnetic shielding and composition technology, which is applied in the field of thermal interface materials, can solve the problems of heat dissipation and electromagnetic interference of thermally conductive gaskets, and achieve the effects of improving thermal conductivity, good electromagnetic shielding performance, and increasing compressibility

Inactive Publication Date: 2016-05-04
PINGHU ALLIED IND
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The technical problem to be solved by the present invention is to provide an electromagnetic shielding heat-conducting composition and an electromagnetic shielding heat-conducting gasket to solve the problems of heat dissipation and electromagnetic interference in existing heat-conducting gaskets

Method used

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  • Electromagnetic shielding heat conducting composition and electromagnetic shielding heat conducting gasket

Examples

Experimental program
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Effect test

Embodiment 1

[0022] An electromagnetic shielding and heat-conducting composition, comprising the following components by mass percentage:

[0023] 10% spherical alumina powder, the average particle size of the powder particles is 150μm;

[0024] 10% spherical aluminum nitride powder, the average particle size of the powder particles is 30μm;

[0025] Fe-based magnetic powder 10%, the average particle size of the powder particles is 100μm;

[0026] Mn-Zn ferrite powder 65%, the average particle size of powder particles is 5μm;

[0027] Silicone rubber 5%.

[0028] Mix and stir the above components evenly, which can be realized by common equipment in the field such as a kneader or a mixer, to obtain an electromagnetic shielding heat-conducting composition;

[0029] The electromagnetic shielding and heat conducting composition obtained above is calendered and sliced ​​to obtain an electromagnetic shielding and heat conducting gasket.

[0030] The thermal conductivity of the obtained elect...

Embodiment 2

[0032] An electromagnetic shielding and heat-conducting composition as described in Embodiment 1, this embodiment has the following difference: it includes the following components by mass percentage:

[0033] 10% spherical aluminum powder, the average particle size of aluminum powder particles is 50μm;

[0034] 10% spherical alumina powder, the average particle size of the powder particles is 5 μm;

[0035] Fe-Ni based powder 65%, the average particle size of powder particles is 50μm;

[0036] CuZn ferrite powder 10%, the average particle size of powder particles is 10μm;

[0037] Silicone rubber 5%.

[0038] Mix and stir the above components evenly, which can be realized by common equipment in the field such as a kneader or a mixer, to obtain an electromagnetic shielding heat-conducting composition;

[0039] The electromagnetic shielding and heat conducting composition obtained above is calendered and sliced ​​to obtain an electromagnetic shielding and heat conducting gas...

Embodiment 3

[0042] An electromagnetic shielding and heat-conducting composition as described in Embodiments 1 and 2, this embodiment has the following differences: it includes the following components by mass percentage:

[0043] 20% spherical aluminum powder, the average particle size of powder particles is 100μm;

[0044] 20% spherical alumina powder, the average particle size of the powder particles is 1 μm;

[0045] Fe-Ni based magnetic powder 25%, the average particle size of powder particles is 60μm;

[0046] M-type flat hexagonal ferrite particles 25%, with an average particle size of 20μm;

[0047] Silicone Gel 10%.

[0048] Mix and stir the above components evenly, which can be realized by common equipment in the field such as a kneader or a mixer, to obtain an electromagnetic shielding heat-conducting composition;

[0049]The electromagnetic shielding and heat conducting composition obtained above is calendered and sliced ​​to obtain an electromagnetic shielding and heat cond...

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Abstract

The invention relates to an electromagnetic shielding heat conducting composition, prepared from the following components in percent by mass: 10-30% of first heat conducting particles, 10-30% of second heat conducting particles, 5-10% of matrix and the balance of magnetic particles. The electromagnetic shielding heat conducting composition has the advantages that by matching the first heat conducting particles and the second heat conducting particles with different particle sizes, filling amount of the heat conducting particles in a polysiloxane matrix material is improved, thereby building an efficient heat conducting network, and improving the heat transfer rate; by filling the magnetic particles into the components, magnetic retardation of the composition can be improved, electromagnetic waves penetrating through the composition can be effectively attenuated, the magnetic particles are irregular in shape and different in size, gaps among the heat conducting particles can be further filled, a compression rate is increased, thermal conductivity is effectively improved, and well electromagnetic shielding performance and excellent radiating effect can be realized under the premise of low hardness.

Description

technical field [0001] The invention relates to the technical field of thermal interface materials, in particular to an electromagnetic shielding heat conducting composition and an electromagnetic shielding heat conducting gasket. Background technique [0002] With the development of microelectronics technology, the components of electronic equipment are highly integrated, the volume is getting smaller and smaller, the running speed is getting faster and the power is getting bigger and bigger, and the resulting heat and heat dissipation problems and electromagnetic interference phenomena have a great impact on electronic products. The impact is also increasing, which will affect its normal work and even cause the product to crash. Many parts of electronic products, such as some chip positions with digital control or power amplification and strong electromagnetic radiation devices, have greater heat dissipation and electromagnetic interference. question. [0003] At present,...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08L83/04C08K13/04C08K7/18C08K3/22
CPCC08K13/04C08K3/22C08K7/18C08K2003/2296C08K2201/003C08K2201/014C08L83/04
Inventor 吴靖
Owner PINGHU ALLIED IND
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