Temperature change film deposition system

Abstract

The invention discloses a temperature change film deposition system. The temperature change film deposition system comprises multiple deposition devices and a substrate transfer device; the multiple deposition devices are uniformly distributed around the substrate transfer device, and have substrate temperature control mechanisms for respectively keeping constant temperature of a substrate bearing platform; the substrate transfer device includes a three-dimensional moving device; a protection gas nozzle is arranged at the tail end of the three-dimensional moving device; and grabbing devices are arranged on two sides of the protection gas nozzle, and are used for grabbing the substrate bearing platform. The temperature change film deposition system, provided by the invention, can deposit multi-element substance deposition films with high efficiency and high quality.

Description

technical field [0001] The invention belongs to the field of atomic deposition coating, and more specifically relates to a variable temperature film deposition system. Background technique [0002] With the development of micro-nano technology and semiconductor integrated circuits, the role of thin film technology is becoming more and more important. The demand for miniature electronic components in the semiconductor industry is getting higher and higher, and there is an urgent need for higher-precision, micro-nano-level thin films, and sometimes a laminated thin-film structure is required according to different functions. However, traditional thin film technologies such as chemical vapor deposition and physical vapor deposition are difficult to meet the current technical requirements. Atomic layer deposition (ALD) technology, as a new thin film technology, is playing an increasingly important role in the field of thin film technology. Because of the self-limiting nature o...

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Problems solved by technology

[0005] In view of the above defects or improvement needs of the prior art, the present invention provides a temperature-variable film deposition system, the purpose of which is to transfer the substrate between multiple deposition devices through the substrate transfer device located in the center of the system, during the conversion process At the same time, the temperature change of the substrate is completed, thereby solving the technical problem of complicated operation caused by cavity switching and deposition temperature when depositing multi-substance thin films.

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