Diameter-changeable pulsating heat pipe

Abstract

The invention discloses a diameter-changeable pulsating heat pipe. The diameter-changeable pulsating heat pipe comprises an evaporation section, a heat insulating section and a condensation section. A pulsating heat pipe vacuumizing opening and a pulsating heat pipe working medium filling opening are formed in the left end and the right end of the condensation section correspondingly. Upper bends and lower bends of the pulsating heat pipe are connected with adjacent main channels with different hydraulic diameters and the main channels with the different hydraulic diameters are distributed and connected in the shape of an S on a whole silicon plate. The diameter-changeable pulsating heat pipe has the advantages of being simple in structure, good in heat transferring performance and easy to miniaturize. Meanwhile, compared with traditional pulsating heat pipes, the outstanding effects that the large pressure difference can be formed more easily compared with the traditional pulsating heat pipes during starting by the aid of the hydraulic diameter differences of the bends of the pulsating heat pipe, frictional resistance and shearing stress are overcome and accordingly the starting time is shortened, the pulsating heat pipe can take more heat away from the evaporation section due to the hydraulic diameter differences of the bends of the pulsating heat pipe compared with the traditional heat pipes, and meanwhile the heat exchange frequency is increased are achieved.

Description

technical field [0001] The invention relates to a variable-diameter pulsating heat pipe, which belongs to the technical field of high-efficiency heat dissipation and cooling of microelectronics and semiconductor components. Background technique [0002] With the rapid development of the electronics industry, the performance of electronic devices is getting better and better, and the integration level is getting higher and higher, and the power that electronic components can generate per unit area is correspondingly larger and larger. For the narrow internal space of electronic devices, such a high heat flux density will cause local or overall high temperature of electronic devices, which will degrade the performance of electronic devices in light cases, and cause thermal deformation in severe cases, resulting in fatigue damage or failure of electronic components. According to statistics, the failure of about 55% of electronic devices is caused by excessive local or overall t...

AI Technical Summary

Problems solved by technology

[0003] The purpose of the present invention is to solve the problem that the conventional single-section pulsating heat pipe is significantly affected by the inclination angle and the overall heat transfer performance is not good, and provides a variable-diameter pulsating heat pipe.

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