Manufacturing process for ultra-thick copper PCB (printed circuit board)

A production process and ultra-thick copper technology, which is used in the manufacture of printed circuits, the manufacture of printed circuit precursors, and electrical components, which can solve the problems of super-thick copper PCB production reports.

Inactive Publication Date: 2016-05-04
东莞翔国光电科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] At present, the copper foil thickness of more printed boards in the industry is usually between 68.6 μm and 137.2 μm,

Method used

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Examples

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Comparison scheme
Effect test

Embodiment

[0031] A manufacturing process of an ultra-thick copper PCB, comprising the steps of:

[0032] (1) Cutting: FR-4 base material is selected, the plate thickness is 1.6mm-1.7mm, and the copper thickness is 137um-138um;

[0033] (2) Drilling positioning;

[0034] (3) Graphic conversion;

[0035] (4) Graphical electroplating: thicken the copper thickness of the circuit through graphic electroplating, so that the circuit and the dry film are equal to facilitate the next dry film;

[0036] (5) Fading film etching;

[0037] (6) Soldering resistance: The board is made by printing oil twice, the first time a 43T screen is used, and after pre-baking, a 77T screen is used for the second printing, and the board is baked after normal rest;

[0038] (7) Curing after solder mask: Carry out segmental curing and bake at the highest temperature for 30-40 minutes;

[0039] (8) Adjust copper thickness;

[0040] (9) repairing holes;

[0041] (10) test;

[0042] (11) Shape repair;

[0043] ...

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Abstract

The invention relates to the technical field of production and manufacturing of a printed circuit board, and specifically to a manufacturing process for an ultra-thick copper PCB (printed circuit board). The manufacturing process comprises the following steps of (1) material preparation: taking FR-4 as the base material, wherein the plate is 1.6-1.7mm in thickness, and copper is 137-138um in thickness; (2) drilling and positioning; (3) performing pattern conversion; (4) performing pattern electroplating; (5) performing film removal and etching; (6) performing solder resist: manufacturing the plate by a way of two times of ink stamping, wherein a 43T screen printing plate is adopted in the first time, and a 77T screen printing plate is adopted after a pre-baking process is carried out for performing the second time of ink stamping; and then performing plate baking after a normal motionless state is achieved; (7) curing after solder resist: performing curing in different stages and further baking for 30-40 min at the maximum temperature; (8) regulating copper thickness; (9) hole modifying; (10) testing; (11) outline repairing; and (12) finished product checking. According to the manufacturing process, two times of dry film laminating for overlapping the circuits layer by layer are adopted for manufacturing the ultra-thick copper PCB so as to obtain a relatively ideal process route; and therefore, the alignment of the circuit can be ensured, and the phenomenon of a mushroom-shaped circuit also can be effectively avoided as well.

Description

technical field [0001] The invention relates to the technical field of circuit board production and processing, in particular to a manufacturing process of an ultra-thick copper PCB. Background technique [0002] With the rapid development of automotive electronics and power communication technology, ultra-thick copper foil circuit boards with a copper foil thickness of 343 μm or more have gradually become a special PCB board with broad market prospects, and are favored by more and more circuit board manufacturers. At the same time, with the increasing application of printed circuit boards in the electronic field, equipment has higher and higher functional requirements for printed circuit boards. Our printed circuit boards will not only provide the necessary electrical connections for electronic components And mechanical support, but also gradually endowed with more additional functions, and the ultra-thick copper foil printed board that can integrate power supply, provide h...

Claims

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Application Information

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IPC IPC(8): H05K3/02
CPCH05K3/022H05K2201/0347
Inventor 赖国恩
Owner 东莞翔国光电科技有限公司
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