Radiator for LED working condition lamp

Abstract

The invention discloses a radiator for an LED working condition lamp. The radiator comprises a hollow radiator body and cooling fins; a reinforcing wall formed by intersecting transverse rib plates with longitudinal rib plates is arranged on the inner wall of the radiator body; the transverse rib plates and the longitudinal rib plates form multiple rhombic hollow areas; and the cooling fins are arranged in positions, on the outer wall of the radiator body, corresponding to the rhombic hollow areas.

Description

technical field [0001] The invention belongs to the technical field of radiators, and in particular relates to a radiator for LED working condition lamps. Background technique [0002] As we all know, the so-called LED refers to light-emitting diodes. As a new type of light source that is widely used and developed rapidly, compared with traditional light sources, LED light source has energy saving, high efficiency, small size, long life, fast response speed, low driving voltage, and shock resistance. Excellent and other advantages, so that it can rapidly develop and expand the industry scale and market share. Under the guidance of industry trends, its technology is constantly updating and deepening. However, the biggest technical barrier restricting the development of LED light sources is the heat conduction and heat dissipation of LED packaging. Settlement problem, that is, the heat dissipation problem of LEDs. As a light source device, LEDs usually need to work continuousl...

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Problems solved by technology

[0002] As we all know, the so-called LED refers to light-emitting diodes. As a new type of light source that is widely used and developed rapidly, compared with traditional light sources, LED light source has energy saving, high efficiency, small size, long life, fast response speed, low driving voltage, and shock resistance. Excellent and other advantages, so that it can rapidly develop and expand the industry scale and market share. Under the guidance of industry trends, its technology is constantly updating and deepening. However, the biggest technical barrier restricting the development of LED light sources is the heat conduction and heat dissipation of LED packaging. Settlement problem, that is, the heat dissipation problem of LEDs. As a light source device, LEDs usually need to work continuously for a long time. Even for cold light sources such as LEDs, long-term work will generate a lot of heat accumulation, which requires LED light sources The heat sink has good working efficiency, and can conduct heat energy through a short conduction path, and minimize the damage caused by excessive temperature to the chip. The current method is to package the LED chip on the heat sinking main bracket, and then heat sinking The main bracket is installed and fixed on a large heat dissipation device, such as a heat dissipation substrate, or an aluminum substrate. The fixed connection between the heat sink main bracket and the heat dissipation device is usually achieved in two ways, one is to transfer heat through thermal paste, The second is the method of using solder paste to transfer heat through reflow soldering, and the most important thing is that both methods will generate high temperature between the LED chip and the heat sink, which will easily damage the LED chip and cause the luminous flux to drop. , the structure of the LED package is damaged, the electrical parameters change, and the light decay increases sharply

[0003] Generally speaking, in the industry, traditional heat sinks are usually designed according to specific application conditions, with relatively fixed dimensions and poor versatility. At present, some manufacturers use small fans to force heat dissipation for LEDs. This method costs High, high failure rate, will also make the size of the entire product relatively large, not streamlined enough

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