Drum type chip burning equipment

A burning equipment, drum-type technology, applied in the direction of conveying record carriers, instruments, computer parts, etc., can solve the problems of insufficient IC placement of IC burning equipment, increasing burning time, and decreasing production speed.

CN105654148AActive Publication Date: 2016-06-08王安松
9 Cites 2 Cited by

Patent Information

Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
Publication Date
2016-06-08

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Abstract

The invention relates to drum type chip burning equipment comprising a burning unit. A first working platform, a second working platform, a drum type burning device, and a material taking device are arranged in the burning unit; a material placing part and a feeding device are arranged at the first working platform; and a conveying device is arranged on the second working platform. The drum type burning device is arranged between the first working platform and the second working platform by a shaft; a plurality of plane parts are arranged at the drum type burning device in an annular mode; and at least one burning machine is arranged at each plane part. According to the invention, the multiple plane parts are arranged at the drum type burning device in an annular mode and each plane part is provided with at least one burning machine; and the drum type burning device is arranged between the first working platform and the second working platform by the shaft. The feeding device can place ICs without burning processing in sequence and the conveying device can take ICs with completed burning in sequence. Therefore, an effect of increasing of the number of placed ICs can be realized by using the drum type burning device and thus the produced number can be increased; and an objective of boosting of the production speed can be achieved.
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Description

technical field

[0001] The invention relates to a chip burning device, especially a drum-type chip burning device capable of increasing the number of IC chips placed. Background technique

[0002] When the existing programming equipment picks and places the IC on the robotic arm, the linear motion X-axis is carried by the linear motion Y-axis. After performing horizontal coordinate positioning, the linear motion Z-axis carried by the Y-axis performs vertical pick-up or placement of the IC. Afterwards, the X and Y motion axes move to another horizontal coordinate, and then the Z axis performs vertical pick-up or placement of the IC. Such sequential actions, because the existing three-axis system cannot process the operating program in parallel, in It greatly affects the production speed, and the existing programming equipment is set to detect the position deviation of the IC before it is placed in the programmer, all of which use the image recognition component, which not onl...

Examples

Embodiment Construction

[0044] see figure 1 , figure 2 As shown, the present invention provides a drum-type chip programming device, which includes:

[0045] Burning equipment 10, this burning equipment 10 is provided with the first working platform 20, the second working platform 30, the drum type burning device 40, the pick-up device 90, and this first working platform 20 is provided with the material seat Moving device 202, and the first working platform 20 is provided with a first material placement part 21, and the first material placement part 21 can be arranged on the material placement seat displacement device 202, and as Figure 5 As shown, the first working platform 20 is provided with a feeding device 22, and the feeding device 22 is provided with a lateral displacement device 221, and the lateral displacement device 221 is provided with a longitudinal displacement device 222, and the longitudinal displacement device 222 is provided with a second A feeding suction nozzle 23, and as Fi...