Three-dimensional millimeter wave array transmitting and receiving system

Abstract

The invention discloses a three-dimensional millimeter wave array transmitting and receiving system. The system mainly is used for solving the problem that the conventional millimeter wave integrated circuit is low in system stability and applicability. The three-dimensional millimeter wave array transmitting and receiving system comprises a three-dimensional millimeter wave front end array and a support system; the three-dimensional millimeter wave front end array comprises an upward radiating surface and four lateral radiating surfaces; each radiating surface is composed of a two-dimensional millimeter wave front end array; the two-dimensional millimeter wave front end array is composed of a plurality of one-dimensional linear arrays; the one-dimensional linear arrays are composed of a plurality of system transmitting and receiving units; the system transmitting and receiving units comprise transmitter integrated circuit modules, receiver integrated circuit modules and endfire on-chip antennas; and each system transmitting and receiving unit is connected through a power dividing network. The system provided by the invention is simple in structure, rational in design and reliable in performance.

Description

technical field [0001] The invention belongs to the technical fields of electronics and millimeter wave (wavelength 1mm to 10mm), and specifically relates to a three-dimensional millimeter wave array transceiver system. Background technique [0002] As the low-frequency band becomes more and more crowded, in the development of modern radar and communication systems, the trend of working frequency bands to higher frequencies is also getting faster and faster. The communication of millimeter-wave and terahertz radars has also made great progress, especially Microelectronics and high-frequency integrated circuits provide a good foundation for its development. However, as the frequency is higher, its operating wavelength is getting shorter and shorter, which brings new challenges to array or phased array communication and radar system arrays. At the same time, traditional mmWave integrated circuit system packaging uses expensive ceramic technology, and the interconnection betwe...

AI Technical Summary

Problems solved by technology

However, as the frequency is higher, its operating wavelength is getting shorter and shorter, which brings new challenges to array or phased array communication and radar system arrays

At the same time, traditional millimeter-wave integrated circuit system packaging uses expensive ceramic technology, and the interconnection between chips can greatly affect matching, especially in the high frequency band of millimeter-wave, which brings uncertainty to system performance and cannot guarantee reliability. repeatability

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