Three-dimensional millimeter wave array transmitting and receiving system

A transceiver system, millimeter wave technology, applied in transmission systems, radio transmission systems, diversity/multi-antenna systems, etc. Spatial scanning, effects of reducing loss and uncertainty, reducing system size

Inactive Publication Date: 2016-06-15
INST OF ELECTRONICS ENG CHINA ACAD OF ENG PHYSICS
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, as the frequency is higher, its operating wavelength is getting shorter and shorter, which brings new challenges to array or phased array communication and radar system arrays
At the same time, traditional millimeter-wave integrated circuit system pack

Method used

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  • Three-dimensional millimeter wave array transmitting and receiving system
  • Three-dimensional millimeter wave array transmitting and receiving system
  • Three-dimensional millimeter wave array transmitting and receiving system

Examples

Experimental program
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Embodiment

[0027] Such as Figure 1-3 As shown, this embodiment provides a three-dimensional millimeter-wave array transceiver system. The transceiver system is a three-dimensional array structure composed of a millimeter-wave circuit and an integrated chip circuit of an antenna. Simply speaking, it is a brick-like end face radiation array.

[0028] In this embodiment, the three-dimensional millimeter wave array transceiver system mainly includes two parts: a three-dimensional millimeter wave front-end array and a support system. The three-dimensional millimeter wave front-end array includes an upward radiating surface and four side radiating surfaces. Each radiating surface is fixed by a two-dimensional millimeter-wave front-end array and the system mechanical structure. The two-dimensional front-end array is composed of several one-dimensional linear arrays. The one-dimensional line array includes several transceiver system units. Each transceiver system unit integrates an on-chip en...

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PUM

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Abstract

The invention discloses a three-dimensional millimeter wave array transmitting and receiving system. The system mainly is used for solving the problem that the conventional millimeter wave integrated circuit is low in system stability and applicability. The three-dimensional millimeter wave array transmitting and receiving system comprises a three-dimensional millimeter wave front end array and a support system; the three-dimensional millimeter wave front end array comprises an upward radiating surface and four lateral radiating surfaces; each radiating surface is composed of a two-dimensional millimeter wave front end array; the two-dimensional millimeter wave front end array is composed of a plurality of one-dimensional linear arrays; the one-dimensional linear arrays are composed of a plurality of system transmitting and receiving units; the system transmitting and receiving units comprise transmitter integrated circuit modules, receiver integrated circuit modules and endfire on-chip antennas; and each system transmitting and receiving unit is connected through a power dividing network. The system provided by the invention is simple in structure, rational in design and reliable in performance.

Description

technical field [0001] The invention belongs to the technical fields of electronics and millimeter wave (wavelength 1mm to 10mm), and specifically relates to a three-dimensional millimeter wave array transceiver system. Background technique [0002] As the low-frequency band becomes more and more crowded, in the development of modern radar and communication systems, the trend of working frequency bands to higher frequencies is also getting faster and faster. The communication of millimeter-wave and terahertz radars has also made great progress, especially Microelectronics and high-frequency integrated circuits provide a good foundation for its development. However, as the frequency is higher, its operating wavelength is getting shorter and shorter, which brings new challenges to array or phased array communication and radar system arrays. At the same time, traditional mmWave integrated circuit system packaging uses expensive ceramic technology, and the interconnection betwe...

Claims

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Application Information

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IPC IPC(8): H04B7/04
CPCH04B7/0408
Inventor 熊永忠邓小东李一虎王瑞涛
Owner INST OF ELECTRONICS ENG CHINA ACAD OF ENG PHYSICS
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