Heat sink insulated liquid refrigeration semiconductor laser and stack array thereof

Abstract

The invention provides a heat sink insulated liquid refrigeration semiconductor laser and a stack array thereof, which are used for meeting the requirements of high power, environmental suitability, reliability and the like. In the heat sink insulated liquid refrigeration semiconductor laser, a first insulation layer is arranged on the upper surface of a liquid refrigerator, a first electric and heat conduction layer is arranged on the first insulation layer, a laser chip and a negative electrode copper sheet are arranged at different positions of the electric and heat conduction layer, a positive surface of the laser chip is directly boned with a first electric and heat conduction layer, an insulation isolation layer exists between the negative electrode copper sheet and the surface of the first electric and heat conduction layer, and the negative electrode copper sheet is connected with a negative electrode of the laser chip through a gold wire or is directly connected with the negative electrode of the laser chip.

Description

technical field [0001] The invention relates to a liquid cooling semiconductor laser. Background technique [0002] At present, the packaging structure of semiconductor lasers is mainly divided into two types: liquid cooling type and conduction cooling type. Due to the limitation of heat dissipation principle, the conduction cooling type is also limited in power realization, and it is difficult to realize high-power devices. Liquid-cooled semiconductor laser packaging structure is currently the main choice for realizing high-power devices. [0003] Liquid-cooled semiconductor laser packaging structures mainly include two types: micro-channel and macro-channel: [0004] 1) Micro-channel liquid-cooled semiconductor lasers can achieve higher power because the micro-channel heat sink dissipates heat very well (there are tiny heat dissipation channels inside), but due to the charged work of the heat sink, there is electrochemical corrosion, which leads to long-term use There is...

AI Technical Summary

Problems solved by technology

[0004] 1) Micro-channel liquid-cooled semiconductor lasers can achieve higher power because the micro-channel heat sink dissipates heat very well (there are tiny heat dissipation channels inside), but due to the charged work of the heat sink, there is electrochemical corrosion, which leads to long-term use There is a problem of channel blockage; this structure has high requirements on the water quality of the refrigeration liquid, once the customer uses tap water or does not change the water in time, it will soon fail;

[0005] 2) The existing macro-channel liquid-cooled semiconductor laser, although the macro-channel heat sink has a larger liquid channel, which obviously improves the problem of micro-channel heat sink blockage, but due to the limitation of its own heat dissipation efficiency, it is limited in achieving higher power

However, due to the charged work of its heat sink, if the water quality is too poor (such as tap water), the product will still fail during use due to metal oxide blockages generated by electrochemical reactions;

[0006] The heat sinks of the lasers with the above two structures are charged when the laser is working, and there are metal oxide blockages produced by the electrochemical reaction of the refrigerant liquid during use, which lead to failure.

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