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Inductor and fabrication method thereof

A manufacturing method and inductance technology, applied in the direction of inductance/transformer/magnet manufacturing, magnetic core manufacturing, transformer/inductor magnetic core, etc., can solve the problem of difficulty in improving the degree of automation, and achieve high saturation characteristics, high efficiency, low DC The effect of resistance

Inactive Publication Date: 2016-06-29
SHENZHEN SUNLORD ELECTRONICS
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

Generally, the curing time of high-temperature glue is usually 30 minutes to 120 minutes. During the curing period, pre-tightening force is applied for a long time. Generally, it can only be done by semi-automatic products, and the degree of automation is difficult to improve.

Method used

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  • Inductor and fabrication method thereof
  • Inductor and fabrication method thereof
  • Inductor and fabrication method thereof

Examples

Experimental program
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Embodiment Construction

[0051] The preferred embodiments of the invention will be further described in detail below.

[0052] Such as Figures 1 to 4 Shown, the manufacturing method of the inductor of an embodiment, comprises the following steps:

[0053] S1. Prepare a magnetic core, the magnetic core includes a first magnetic core 11 and a second magnetic core 12, wherein the first magnetic core includes a first mating surface 11a of the first magnetic core and a second mating surface of the first magnetic core 11b, the second magnetic core 12 includes a first mating surface 11a of the second magnetic core and a second mating surface 12b of the second magnetic core, when the first magnetic core 11 and the second magnetic core 12 are combined, the first The first mating surface 11a of the magnetic core is closely attached to the first mating surface 11b of the second magnetic core, as figure 2 shown.

[0054] In order to ensure that the first mating surface 11a of the first magnetic core and the ...

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Abstract

The invention discloses an inductor and a fabrication method thereof. The method comprises the following steps of processing a second matching surface of a first magnetic core and / or a second matching surface of a second magnetic core, so that a gap with a set width is formed between the second matching surface of the first magnetic core and the second matching surface of the second magnetic core when the first magnetic core and the second magnetic core are engaged; engaging the first magnetic core and the second magnetic core so that a first matching surface of the first magnetic core and a first matching surface of the second magnetic core are closely engaged and the gap is relatively formed between the second matching surface of the first magnetic core and the second matching surface of the second magnetic core; binding the first magnetic core and the second magnetic core together by a fastening tape; injecting a non-magnetic binding agent into the gap, wherein the non-magnetic binding agent is used for pasting the first magnetic core and the second magnetic core together; and fixing a conductive winding on the magnetic cores.

Description

【Technical field】 [0001] The invention relates to an inductor and a manufacturing method thereof. 【Background technique】 [0002] With the development of semiconductor technology, the operating current of a single CPU is above 50A. For the DC-DC circuit that supplies power to the CPU, the operating current of the surrounding power inductors is required to increase accordingly. Due to the requirement of high energy efficiency, the resistance value of the inductor is also required to be smaller and smaller, so as to reduce the heat generated by the current. At the same time, for the miniaturization of the device, the operating frequency of the inductor is also increased, and the current mainstream frequency is 500KHz ~ 1MHz. The common inductance value ranges from 50nH to 680nH. Existing applications and the high current power inductance of this circuit often adopt the following two mainstream modes: [0003] One is to adopt the overall magnetic core mode. Cut the FTcore o...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01F41/02H01F27/26
CPCH01F41/0206H01F27/263
Inventor 何海根刘燕侯勤田王永杰
Owner SHENZHEN SUNLORD ELECTRONICS
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