Packaging method for bonding-wire-free high-color-rendering-index LED lamp filaments and bonding-wire-free high-color-rendering-index LED lamp filaments

Abstract

The invention relates to a packaging method for bonding-wire-free high-color-rendering-index LED lamp filaments. The packaging method comprises the steps of manufacturing a small-sized packaging body; coating the surface, except a welding electrode surface, of a flip chip with fluorescent glue only containing red fluorescent powder; drawing multiple mutually-disconnected connecting circuits on a thin-strip-shaped substrate, wherein each connecting circuit comprises two conductive bonding pads, and the two conductive bonding pads are connected through a conductive circuit; arranging the small-sized packaging body on the substrate circuit in an eutectic welding manner; enabling welding electrodes to be welded with the conducive bonding pads on the two adjacent connecting circuits to enable the adjacent two connecting circuits to be conducted in sequence; and coating the front surface and the back surface of the thin-strip-shaped substrate with the fluorescent glue containing green or yellow green fluorescent powder to obtain the bonding-wire-free high-color-rendering-index LED lamp filaments. The problem of partial spectrum missing and excitation efficiency decline caused by the reason that the light emitted by green or yellow or other short-wave fluorescent powder is re-excited is solved, so that the purpose of increasing the color rendering index and lowering the fluorescent powder dosage is realized.

Description

technical field [0001] The invention relates to the technical field of LED packaging, in particular to a packaging method for a wire-free high CRI LED filament and a wire-free high CRI LED filament manufactured according to the packaging method. Background technique [0002] Compared with the traditional incandescent lamp, the incandescent lamp made of LED filament has a similar shape and light distribution curve, and the bulb technology is mature and the price is low; at the same time, it has 360-degree full-angle light, no aperture; high CRI, high luminous efficiency, no need for independent Heat dissipation and other characteristics. [0003] However, there are many problems in the development of LED bulbs, the main constraint is the LED filament. The LED filament encapsulates multiple chips on a thin substrate, and the two sides are coated with fluorescent glue containing two or more red, green, and yellow phosphors that are uniformly mixed. At present, the LED filamen...

AI Technical Summary

Problems solved by technology

[0004] The technical problem solved by the present invention is that the light emitted by short-wave phosphors such as green or yellow in the prior art is re-excited, resulting in the loss of part of the spectrum, resulting in a reduction in product display and phosphor excitation efficiency, and a good product quality caused by connecting chips with metal wires. Low efficiency, high production cost, poor heat dissipation and reliability

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