Etching-resistant jet ink and application thereof

An inkjet ink and anti-etching technology, applied in applications, anti-corrosion parts, inks, etc., can solve problems such as environmental pressure, long process, and various plate making, and achieve stable printing performance and good fluidity.

Active Publication Date: 2016-07-06
ZHUHAI FREE TRADE ZONE NEOJET APOLLOJET IMAGING MATERIALS
View PDF3 Cites 13 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the problem of using screen printing is that there are many plates and a long process, and a large amount of waste ink will be generated during use, whic

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Etching-resistant jet ink and application thereof
  • Etching-resistant jet ink and application thereof
  • Etching-resistant jet ink and application thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1~6

[0028] 1) take by weighing each component of embodiment 1-6 according to corresponding formula in following table 1;

[0029] 2) Mix monomers, oligomers, photoinitiators, and colorants, and stir until fully dissolved;

[0030] 3) Add surface additives and stabilizers, stir evenly, and filter with a filter membrane with a pore size of 1 μm under the condition of avoiding ultraviolet light indoors to complete ink preparation.

[0031] Table 1

[0032]

[0033] Oligomer 648-1 (Changxing) in Table 1 is carboxyl-containing acrylate; EM214 used is tetrahydrofurfuryl acrylate, EM75 is benzyl acrylate, EM211 is ethoxyethoxyethyl acrylate, EM221 is 1,6-hexanediol diacrylate, EM235 is pentaerythritol triacrylate, and SR508 is dipropylene glycol diacrylate. The colorant is specifically selected as SudanBlue670, and those skilled in the art can also select other existing colorants as required. The raw materials in Table 1 are all commercially available raw materials, among which, EM...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

PUM

No PUM Login to view more

Abstract

The invention provides etching-resistant jet ink and provides a method for preparing a conductive circuit by using the etching-resistant jet ink. The etching-resistant jet ink comprises a photocuring monomer, an oligomer, a pigment and a photoinitiator, wherein the photocuring monomer comprises at least one of monofunctional (methyl) acrylate, bidirectional (methyl) acrylate and tri-functional acrylate; the bidirectional (methyl) acrylate comprises at least one of bidirectional (methyl) acrylate with a glycol structure or propylene glycol structure in the molecular structure. The etching-resistant jet ink is good in flowability, applicable to jet ink technique and good in stable jet printing property, a temporary protecting layer formed after the jet ink is cured can meet the process requirements of the circuit board in the production process and is resistant to corrosion of an etching liquid without dropping, and rapid stripping can be achieved in an alkali liquid after the etching process is completed.

Description

technical field [0001] The invention relates to an anti-etching ink-jet ink, which is mainly used in the etching stage of the circuit board manufacturing process to form a temporary protective layer to prepare circuits. Background technique [0002] The etching stage of the circuit board (PCB) is the process of making conductive lines. The usual method is to make a plate first, and then use ink to print the circuit pattern on the copper clad board by screen printing, and then form it through exposure, development and other processes. Temporary protective layer, the unprotected bare copper part is etched away in the etchant. After the etching is completed, the ink protective layer needs to be removed in lye to form a conductive line. However, the problem of using screen printing is that there are many plates and a long process, and a large amount of waste ink will be generated during use, which will bring pressure to the environment. [0003] Digital inkjet technology is a ...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

Application Information

Patent Timeline
no application Login to view more
IPC IPC(8): C09D11/40H05K3/06
CPCC09D11/40H05K3/06H05K2203/0562H05K2203/1383
Inventor 韦善强黄云欣
Owner ZHUHAI FREE TRADE ZONE NEOJET APOLLOJET IMAGING MATERIALS
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Try Eureka
PatSnap group products