Printed circuit board assembly with image sensor installed
A technology of printed circuit boards and sensors, applied in circuits, electrical components, electrical solid devices, etc., can solve the problems of poor heat dissipation, insufficient resistance of chips and printed circuit boards, etc., and achieve the effect of reducing thickness
Inactive Publication Date: 2018-08-07
SUNASIC TECH
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Problems solved by technology
The glue is distributed between the chip 3 and the printed circuit board 1. The mismatch caused by expansion prevents stress concentration on the solder ball 7, which can lead to premature failure.
The heat dissipation effectiveness of this paste for solder balls becomes worse as the fan-out of chip logic gates increases and the associated pads for soldering become smaller
At the same time, if the chip 3 is a fingerprint recognition sensor chip, the bonding force between the chip and the printed circuit board may not be enough to resist the external force exerted by the finger.
Method used
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[0024] The present invention will be described more specifically by referring to the following embodiments.
[0025] see Figure 3 to Figure 11 , these figures are used to illustrate an embodiment. image 3 A top view of a printed circuit board assembly. The printed circuit board assembly includes a printed circuit board 100 and an image sensor chip 200 . Many image sensor chips can be used. In this embodiment, the image sensor chip 200 is a fingerprint reader. Please note that the depictions in the drawings may not be to scale and are for illustrative purposes only. The image sensor chip 200 may occupy less space than the printed circuit board 100 of the printed circuit board assembly. Please note the image 3 In , a section line AA' is noted. For a better understanding, a section along section line AA' is used as illustration in the subsequent figures.
[0026] Since the PCB assembly is used as a fingerprint reader module, the PCB 100 has a number of major components...
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The invention discloses a printed circuit board assembly and a method for assembling the same. The printed circuit board assembly consists of a printed circuit board, an image sensing chip, and a protection layer. The printed circuit board includes a first insulation layer, a second insulating layer, a first conductive layer, a second conductive layer, and a third conductive layer. The image sensing chip has a plurality of connecting pads and a sensor part passing through a second opening in a facing down mode. The printed circuit board assembly serves as an image sensing module and the thickness of the module can be minimized.
Description
technical field [0001] The present invention relates to a printed circuit board assembly, in particular to a printed circuit board assembly installed with an image sensor. Background technique [0002] Silicon chips or integrated circuits are the core components of electronic devices, usually in the form of packages. With the research and development of manufacturing technology and the demand for thin and light design of final products, different packaging methods have been invented to meet this demand. Most of the time, silicon chips are sealed in a protective material such as epoxy. In some cases, especially when the silicon chip is a sensing device, such as a fingerprint sensor chip, the silicon chip needs to be mounted on a substrate with its surface exposed. At the same time, for the fingerprint identification device, the thickness of the packaged sensor must be as thin as possible. Therefore, the technique of bonding the silicon chip to the substrate plays a very im...
Claims
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IPC IPC(8): H01L23/13
CPCH01L2224/16H01L2224/48091H01L2924/00014
Inventor 林继周和正平
Owner SUNASIC TECH