Method for preventing blistering of electroplating copper of resin-filled board

Abstract

The invention discloses a method for preventing blistering of electroplating copper of a resin-filled board. The method comprises the following steps of 1) after laminating an inner-layer core board and an outer-layer copper foil, drilling a through hole and a buried hole once; 2) performing outer-layer copper deposition and metalizing the through hole and the buried hole; 3) making a hole-covering dry membrane after complete board electroplating, and covering the through hole with the dry membrane; 4) filling the buried hole with resin; 5) grinding the board by an abrasive belt; and 6) after removing the dry membrane, performing secondary outer-layer copper deposition and secondary complete board electroplating. According to the method, the through hole and the buried hole are drilled once and subjected to full copper electroplating, the buried hole is filled with the resin, and the board is ground by the abrasive belt, so that the risk of copper skin blistering caused by poor copper foil adhesion due to an excessively thin copper layer on the surface of the circuit board after board grinding by the abrasive belt is prevented, the problems of circuit board expansion and contraction and coefficient re-measurement for making the through hole caused by board grinding by the abrasive belt are improved, a technological process is simplified, the production efficiency is improved, and the production yield is increased.

Description

technical field [0001] The invention belongs to the technical field of printed circuit board production, and in particular relates to a method for preventing a circuit board containing resin plug holes from foaming during copper electroplating. Background technique [0002] In recent years, the resin plugging process has been widely used in the PCB industry, especially in products with high layers and thick circuit boards. [0003] In the prior art, circuit boards containing resin plug holes are usually prepared by the following process: firstly, the resin plug holes are made, and then the copper layer of 7-11um is fabricated by sinking copper plate, and then the holes are plated with enough copper by the plating process, and abrasive belt grinding Make through holes after the board, because the surface copper thickness will be ground off at least 6um during the abrasive belt grinding process, while the original electrical copper is only 7-11um, after the abrasive belt grind...

AI Technical Summary

Problems solved by technology

[0003] In the prior art, circuit boards containing resin plug holes are usually prepared by the following process: firstly, the resin plug holes are made, and then the copper layer of 7-11um is fabricated by sinking copper plate, and then the holes are plated with enough copper by the plating process, and abrasive belt grinding Make through holes after the board, because the surface copper thickness will be ground off at least 6um during the abrasive belt grinding process, while the original electrical copper is only 7-11um, after the abrasive belt grinding, the electrical copper thickness of the board is less than 5um, and the subsequent circuit board will be heated In the end, the bonding force of the copper foil will be poor due to the thin copper plate, which will cause quality problems such as copper skin blistering.

After grinding the board with the abrasive belt, the production board will be pulled up by the abrasive belt, causing the board to expand and shrink. When making the outer layer drilling, it is necessary to re-measure the coefficient and re-shoot the target. The production process is long and increases the workload.