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The method of post-treatment of pcb board after spraying tin

A technology of PCB boards and tin-sprayed boards, applied in the direction of electrical components, printed circuit manufacturing, printed circuits, etc., can solve the problems that the cooling efficiency of tin-sprayed boards cannot be guaranteed, and affect production capacity, etc., so as to improve production capacity, product quality, and strong applicability , the effect of improving the utilization rate

Active Publication Date: 2018-05-11
苏州市惠利华电子有限公司
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  • Abstract
  • Description
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AI Technical Summary

Problems solved by technology

[0003] The technical problem to be solved by the present invention is to provide a method for post-treatment of HASL on PCB boards, to solve the problem that the existing technology can not guarantee the cooling efficiency of HASL and affect the production capacity and quality when the amount of HASL is large. question

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  • The method of post-treatment of pcb board after spraying tin
  • The method of post-treatment of pcb board after spraying tin

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Embodiment Construction

[0020] The post-treatment method of a kind of PCB board tin spraying of the present invention is to carry out on a gas floating bed, and the structure of the gas floating bed is as follows: figure 1 As shown, a slide rail 4 , a first inductor 2 , a second inductor 3 , a first pin baffle 5 , a second pin baffle 6 and a swash plate 1 are provided. The inclined plate 1 is provided with a pre-cooling section 13 , a cooling section 12 and a plate-out section 11 sequentially from front to back. The first sensor 2 is installed above the front end of the pre-cooling section 13, and the first sensor 2 is used to monitor the size information of the tin plate 7, and transmit this information to the control center (not shown in the figure) of the gas floating bed. The second inductor 3 is located above the cooling section 12, and the two ends of the second inductor 3 are connected to the slide rails 4 on both sides of the gas floating bed, and the second inductor 3 is used to monitor the ...

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Abstract

The invention discloses a PCB tin spray post-processing method. Tin spray plates and an air floating bed are provided. The air floating bed comprises a slide rail, a first sensor, a second sensor, a first pin baffle, a second pin baffle, and an inclined plate. The inclined plate is provided with a pre-cooling section, a cooling section, and a plate output section sequentially from front to back. The method comprises the following steps: adjusting the second sensor to an appropriate position according to the size information of the tin spray plates and the wind strength of the air floating bed; holding two tin spray plates on the cooling section and on the pre-cooling section respectively; pre-cooling and cooling the held tin spray plates respectively, making the cooled tin spray plate flow out of the floating bed, holding the pre-cooled tin spray plate and a subsequent tin spray plate on the cooling section and on the pre-cooling section respectively, cooling and pre-cooling the pre-cooled tin spray plate and the subsequent tin spray plate respectively, and repeating the operation until the last tin spray plate in the batch is cooled. The utilization rate of the floating bed is improved, the cooling efficiency of tin spray plates is ensured, and the production capacity and product quality are improved.

Description

technical field [0001] The invention relates to a method for treating a PCB after spraying tin, in particular to a method for cooling a PCB after spraying tin on a gas floating bed. Background technique [0002] At present, for the PCB board after the tin-spraying treatment (hereinafter referred to as the tin-spreading board), a post-treatment process of cooling it on a floating bed is required. The commonly used floating bed structure design adopts a single-chip processing mode, and there cannot be two HASLs on the floating bed at the same time. When the amount of HASL is large, this floating bed structure and the existing processing method cannot meet the production capacity requirements. If the residence time is adjusted, the quality will be affected. If the board is placed directly according to the existing plan without adjustment, two boards will be caused. Stacking or bumping together will cause scratches or even scrapping, so it is necessary to design a new method to...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H05K3/00
CPCH05K3/00H05K2203/1121
Inventor 王玮
Owner 苏州市惠利华电子有限公司
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