Composite encapsulating structure for high-frequency electrical product

Abstract

The invention discloses a composite encapsulating structure for a high-frequency electrical product. The composite encapsulating structure comprises a shell, a cover covering the opening in the top of the shell, and the high-frequency electrical product arranged in the shell, and is characterized in that flexible glue insulators are encapsulated between the high-frequency electrical product and the inner wall of the shell, hard glue insulators are encapsulated between the upper surface of the flexible glue insulators and the bottom surface of the cover. Compared with the existing single pouring sealant technology of the high-frequency electrical products such as a high-frequency transformer or an electric reactor, the composite encapsulating structure has the following advantages that 1, the temperature is reduced for more than 5K (compared with the single hard glue); the noise is reduced for more than 3dB (compared with the single hard glue); 3, the composite encapsulating structure can pass through a high-low temperature impact test (compared with the single hard glue); and 4, the composite encapsulating structure can pass through a drop test (compared with the single flexible glue), and can be installed in any direction (compared with the single flexible glue).

Description

technical field [0001] The invention relates to the technical field of high-frequency electrical products, in particular to a composite potting structure for high-frequency electrical products applied to high-power power electronic equipment. Background technique [0002] The high-frequency (1-50kHz) transformers and / or reactors currently used in high-power power electronic equipment have stable electrical performance, and are smaller in size and lower in loss than industrial frequency (50 / 60kHz) transformers. However, due to working in a high-frequency state, the noise in the open installation is about 80-100dB (select A-level weighting at 1 meter away from the measured object with a noise meter), which is far greater than the standard value (not greater than 75dB), so the high-frequency Transformers or reactors need special processing to reduce noise. The mainstream noise reduction technology in the current market is integral potting, [0003] Commonly used potting glue ...

AI Technical Summary

Problems solved by technology

The main component of conventional soft glue is silica gel, which has the advantages of high thermal conductivity (above 1.0), high temperature resistance (above 180 degrees), and no cracking (high and low temperature impact) no matter how thick the potting layer is, the disadvantage is that the bonding strength is low and easy fall off

The main component of conventional hard glue is epoxy resin, which has the advantages of high strength and high adhesion, but the disadvantages are general thermal conductivity (about 0.8), general temperature resistance (155-180 degrees), and potting layer greater than 30mm is easy to crack (high low temperature shock)

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