SMT stencil windowing design method for VGA connector

A design method and connector technology, applied in metallurgical bonding, electrical components, printed circuit manufacturing, etc., can solve problems such as compressed height and space, and achieve the effects of ensuring welding quality, mass production, and easy processing

Active Publication Date: 2016-07-27
LANGCHAO ELECTRONIC INFORMATION IND CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In recent years, connectors conforming to the SMT reflow soldering process have been gradually produced to replace the VGA connectors of the traditional wave soldering process, which further reduce...

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment

[0012] A kind of SMT stencil window opening design method of VGA connector described in this embodiment, by calculating the thickness of the PCB board and the PIN through hole size corresponding to the VGA connector on the PCB board, calculate the thickness and opening of the SMT stencil The size of the window meets the soldering requirements of VGA connectors that can be reflow soldered. The specific steps of the SMT stencil window design method include: first analyzing the composition of the solder paste, secondly obtaining the size information of the PCB board and the corresponding VGA connector, finally calculating the window size of the SMT stencil, and calculating the printed solder paste. quantity.

[0013] The SMT stencil window opening design method described in this embodiment, when carrying out specific embodiments, first analyze the composition of the solder paste. The ratio of solder paste flux to tin powder used in the SMT industry is 11:89, so after reflow solde...

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PUM

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Abstract

The invention discloses an SMT stencil windowing design method for a VGA connector, and relates to the SMT production field of a PCB. The thickness and the windowing dimensions of the SMT stencil can be calculated by working out the thickness of a PCB card and the dimensions of a PIN through hole which is formed, corresponding to the VGA connector, in the PCB card. By adoption of the method, sufficient tin amount can be supplied to the reflow soldering of the VGA connector, so that the batch production of the VGA connector can be realized, and the stencil can be processed easily; the quantity production of the SMT of the VGA connector is realized; the welding quality is ensured; and therefore, the windowing design method has significant popularization and utilization values.

Description

technical field [0001] The invention relates to the field of SMT production of PCBs, in particular to a design method for SMT steel mesh window opening of a VGA connector. Background technique [0002] With the continuous development of notebook computers towards lighter and thinner computers, the thickness requirements for the external connection ports of notebook computers are becoming increasingly stringent, and the external connection ports of circuit boards have become a key factor restricting the thinning and thinning of notebook computers. Audio interface, USB interface, VGA interface, etc. are several major devices that component manufacturers are eager to improve at present, especially the VGA interface, which prompts VGA connector manufacturers to develop connectors with small space requirements. In recent years, connectors conforming to the SMT reflow soldering process have gradually been produced to replace the VGA connectors of the traditional wave soldering pro...

Claims

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Application Information

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IPC IPC(8): H05K3/34
CPCH05K3/341H05K2203/04
Inventor 孙青华冯金星
Owner LANGCHAO ELECTRONIC INFORMATION IND CO LTD
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