Method for testing PCB adhesive removing uniformity

Abstract

A method for testing PCB adhesive removing uniformity includes the following steps that 1, a set of test boards are provided, wherein each test board is divided into a plurality of test strip zones, and a plurality of through holes of different specifications are formed in each test strip zone, penetrate through the corresponding whole test board and are distributed in the whole test strip zone; 2, fretting corrosion testing is carried out; 3, data measuring is carried out to obtain the fretting corrosion amount L of the wall of each through hole in each test strip zone and the fretting corrosion amount A of the walls of the through holes of different diameters; 3, parameter processing is carried out.According to the method, the test boards are placed in a plasma adhesive removing machine to test the fretting corrosion degree of the through holes, the fretting corrosion effect is evaluated, preparation is made for subsequent PCB production, the adhesive removing effect on the through holes of PCBs in the production process is evaluated, the quality risks that circuit opening occurs at the connecting parts of plating layers and inner layers of the through holes of the PCBs and folding plating of the through holes occurs are effectively prevented, and the practicability is high.

Description

technical field [0001] The invention relates to a test method, in particular to a test method for the uniformity of glue removal of a PCB board. Background technique [0002] In the production process of PCB boards, it is necessary to treat the residual drilling dirt after drilling. At present, the potassium permanganate method is more commonly used in the industry to remove drilling dirt, that is, in a strong alkaline solution, the chemical bonds in the resin system are opened through the strong oxidation of potassium permanganate, so that the resin dissolves into the strong alkaline permanganate In the potassium solution, the debris generated by drilling is completely removed, and the hole wall is smoothed. However, the effect of potassium permanganate to remove drilling dirt is not good, and it is easy to affect the quality of the product. There are still many deficiencies in the way of using potassium permanganate to remove drilling dirt. [0003] In addition, the biti...

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Problems solved by technology

However, the effect of potassium permanganate to remove drilling dirt is not good, and it is easy to affect the quality of the product. There are still many deficiencies in the way of using potassium permanganate to remove drilling dirt.

[0003] In addition, the biting rate of drilling stains is an important reference for the decontamination effect. At present, the industry does not have a good test method for the biting rate and uniformity of the drilling stains, and it is impossible to guarantee the uniformity of the quality of each blind hole on the board. The quality of the board cannot be guaranteed; the processing parameters for desmearing cannot be accurately determined, and the erosion effect on the via holes cannot be judged, resulting in the risk of insufficient or excessive adhesive removal of the through holes in the actual PCB processing process. A new test method for the uniformity of glue removal on PCB boards is needed

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