A high dimensionally stable sn‑ag‑cu solder for electronic packaging

Abstract

The invention discloses high-dimensional stability Sn-Ag-Cu solder suitable for electronic packaging. The main component metal elements of the solder include Sn, Ag, Cu and Be. According to the solder, the excellent melting property, the excellent welding performance and the excellent mechanical property of Sn-Ag-Cu solder alloy are maintained, the elasticity modulus of a welding connector can also be remarkably improved, a welding spot is made to have high toughness, the dimensional stability is good, and the solder is particularly suitable for ultra-small interval electronic packaging. The electric conductivity and heat conductivity of the prepared welding spot can also be improved, so that the welding spot still has the excellent comprehensive service performance while bearing electric, thermal and mechanical loads and accords with the miniaturization, precision and high-performance development tendency of modern electronic components, the using reliability of the electronic products is improved, and the service life of the electronic products is prolonged. Furthermore, through one or more of Al, Ni and V, the high-temperature oxidation resistance, wettability, fluidity and high-temperature chemical stability of the solder can be further improved, the solder alloy is refined, and the mechanical property of the welding spot is improved.

Description

technical field [0001] The invention relates to a solder, in particular to a Sn-Ag-Cu solder with high dimensional stability suitable for electronic packaging. Background technique [0002] With the development of electronic products in the direction of thin, light, small, digital and multifunctional, the development trend of miniaturization, precision and high performance of electronic components will be further accelerated, which will increase the number of solder joints used in electronic packaging, The size is getting smaller and the spacing is getting narrower, but the thermal, electrical, and mechanical loads it bears are getting higher and higher. Studies have shown that 70% of the failures of electronic devices are caused by the failures of packaging and assembly, among which the failure of solder joints is the main reason. [0003] Solder joints can not only serve as electrical channels in electronic packaging, but also provide mechanical connections between chips ...

AI Technical Summary

Problems solved by technology

[0005] Sn-Ag-Cu solder has excellent mechanical properties and solderability, but in the application process, it is found that its dimensional stability is relatively poor during service, and the performance of ultra-fine pitch microelectronic packaging cannot meet the requirements.

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