Tool for fast mounting and demounting LD die bar and elastic piece and use method of tool

Abstract

The invention relates to a tool for fast mounting and demounting an LD die bar and an elastic piece and a use method of the tool and belongs to the technical field of electronic packaging production. The tool comprises a base, a left rocker arm fixing base located on the base and a moving seat located on the base. The left rocker arm fixing base is provided with a left rocker arm and a die bar mounting and demounting clamping buckle. The left rocker arm controls the die bar mounting and demounting clamping buckle to conduct clamping and stretching. Guide rails are arranged on one side of the left rocker arm fixing base. The moving seat is provided with rails cooperatively connected with the guide rails. The die bar is arranged on the moving seat and is driven by the moving seat to move to the position of the die bar mounting and demounting clamping buckle, and the die bar mounting and demounting clamping buckle conducts clamping and stretching so as to complete mounting and demounting of the die bar and the elastic piece. By means of the tool for fast mounting and demounting the LD die bar and the elastic piece, the mounting and demounting yield of a semiconductor laser is increased, the production efficiency is improved on the premise that the quality of the product is ensured, operation defects in existing production are overcome, the phenomena that a pipe leg is bumped to be bent through the product, a light-emitting face is contaminated and a pipe seat is abnormally mounted and demounted due to manual operation are reduced, and the tool has the beneficial effects of being small in size, simple in structure, practical and convenient to use.

Description

technical field [0001] The invention relates to a tooling for fast loading and unloading of LD mold strips and shrapnel and a use method thereof, belonging to the technical field of electronic packaging production. Background technique [0002] Semiconductor lasers are widely used in optical recording, optical communication, national defense, industry and medical treatment, etc. Especially in the field of electronic equipment, lasers have a wide range of applications. Now semiconductor lasers can be seen in many fields. In most applications, the cost of the devices is an important factor, which is also the main factor related to their commercialization. In the current semiconductor industry, there are various production methods. The disassembly and assembly of mold strips and shrapnel determines the quality of the device to a certain extent. The importance of mold strip and shrapnel assembly and disassembly tooling is particularly important in the semiconductor laser product...

AI Technical Summary

Problems solved by technology

[0003] At present, there are disassembly and assembly procedures for semiconductor lasers in the industry. Since the semiconductor laser requires a particularly clean environment during the production process, the disassembly operation affects the ultra-clean environment of the entire semiconductor laser production to a certain extent. If the ultra-clean environment is not enough, it will affect the quality of the entire product

The essence of the semiconductor laser is the extension and development of the triode. Its external structure determines the difficulty in its production process to a certain extent, that is, the die of the semiconductor laser is too small and the welding line is too thin. Accuracy will lead to damage to the die, short circuit or open circuit of the welding line

However, because the product is too small in the production process, currently in the semiconductor laser production and packaging industry, there are installation tools for a single semiconductor laser, such as a laser diode installation fixture disclosed in Chinese patent documents (notification number CN202384635U), including a level of The work platform is fixedly connected with a workpiece seat, the top of the work seat is fixed with a laser base, and a laser diode support to be installed with a laser diode is arranged in the laser base, and a five-dimensional adjustment device is also fixedly connected with the work platform. The device includes a horizontally extending boom, and the end of the boom away from the five-dimensional adjustment device is provided with a fixture corresponding to the laser diode to be installed, and the fixture is facing the laser diode support to position the installation of the LD position, but the patent document is only for the processing and assembly of a single LD, which has little applicability. For the mold strips and shrapnel used in mass production, the disassembly and assembly of the mold strips and shrapnel at this stage is mainly done manually. This operation The method not only wastes time but also affects the quality and consistency of the product. Due to the influence of external forces in the production process of semiconductor lasers, the three tube legs of the semiconductor laser are skewed to varying degrees, and the skew of the tube legs slows down to a certain extent. The progress of the loading and unloading process of the mold strips will be affected, and it will also affect the operation process of the next process. Moreover, the utility model mentioned in the patent has a complex structure and high processing costs. Therefore, the loading and unloading of the mold strips determines the quality of semiconductor products to a certain extent. final work result

Images