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A kind of ultraviolet led encapsulation structure and manufacturing method thereof

A technology of LED packaging and manufacturing method, applied in semiconductor devices, electrical components, circuits, etc., can solve the problems of easy aging of ultraviolet LED devices, and achieve the effects of improving packaging efficiency and reliability, improving light extraction efficiency, and simple production.

Active Publication Date: 2019-03-05
HUAZHONG UNIV OF SCI & TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] Aiming at the above defects or improvement needs of the prior art, the present invention provides an ultraviolet LED packaging structure and its manufacturing method, which solves the problems of easy aging and airtight packaging of ultraviolet LED devices, and improves the light extraction efficiency and reliability of ultraviolet LED devices

Method used

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  • A kind of ultraviolet led encapsulation structure and manufacturing method thereof
  • A kind of ultraviolet led encapsulation structure and manufacturing method thereof
  • A kind of ultraviolet led encapsulation structure and manufacturing method thereof

Examples

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Embodiment 1

[0050] see image 3 , the ultraviolet LED packaging structure provided by the first embodiment of the present invention, which includes an ultraviolet LED chip 38 , a glass cover 31 and a ceramic base 35 . The glass cover 31 is disposed on the ceramic substrate 35 and encapsulates the ultraviolet LED chip 38 in the ceramic base 35 .

[0051] The ceramic base 35 defines a groove 34 , and a circuit layer 36 is formed at the bottom of the groove 34 . In this embodiment, the circuit layer 36 is electrically connected to the conductive through hole opened on the ceramic base 35 , and is electrically connected to the outside through the conductive through hole. The ultraviolet LED chip 38 is disposed in the groove 34 , and the circuit layer 36 is electrically connected to the ultraviolet LED chip 38 through a gold wire 37 .

[0052] A second metal layer 33 is formed on the upper surface of the groove wall of the groove 34 , and the ceramic base 35 is connected to the glass cover 3...

Embodiment 2

[0077] see Figure 4 , the ultraviolet LED packaging structure provided by the second embodiment of the present invention, which includes an ultraviolet LED chip 49 , a glass cover 41 and a ceramic base 46 . The glass cover 41 is disposed on the ceramic base 46 and encapsulates the ultraviolet LED chip 49 in the ceramic base 46 .

[0078] The ceramic base 46 defines a groove 45 , and a circuit layer 47 is formed at the bottom of the groove 45 . In this embodiment, the circuit layer 47 itself is electrically connected to the outside. The ultraviolet LED chip 49 is disposed in the groove 45 , and the circuit layer 47 is electrically connected to the ultraviolet LED chip 49 through a gold wire 48 .

[0079] A second metal layer 44 is formed on the upper surface of the groove wall of the groove 45 , and the ceramic base 46 is connected to the glass cover 41 through the second metal layer 44 . In this embodiment, the shape and position of the second metal layer 44 correspond to ...

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Abstract

The invention discloses an ultraviolet LED packaging structure and a manufacturing method thereof. The packaging structure comprises an ultraviolet LED chip, a glass cover plate and a ceramic base. The upper and lower surfaces of the glass cover plate are respectively provided with a roughening structure, and the external edge of the glass cover plate is provided with a first metal layer. The ceramic base is internally provided with a groove which is used for placing the ultraviolet LED chip. A circuit layer is formed at the bottom part of the groove. The upper surface of the groove wall of the groove is provided with a second metal layer. The second metal layer and the first metal layer are welded together an induction local heating technology so that the glass cover plate and the ceramic substrate are enabled to be fixedly connected. The problems of organic material aging and airtightness of ultraviolet LED packaging can be solved, and reflected light loss is effectively reduced and the light emergent efficiency of a device is enhanced through the double roughening structures of glass; and the induction local heating welding technology is adopted so that the heat effect of high temperature on the LED chip can be reduced and the device reliability can be enhanced.

Description

technical field [0001] The invention belongs to the related field of semiconductor packaging technology, and more specifically relates to an ultraviolet LED packaging structure and a manufacturing method thereof. The ultraviolet LED packaging structure has high light extraction rate and reliability, is not easy to be oxidized, and has good air tightness; and its manufacturing method has high flexibility and wide application range. Background technique [0002] Compared with traditional ultraviolet light sources (such as mercury lamps), ultraviolet light-emitting diodes (LEDs) have the advantages of energy saving, environmental protection, fast response, controllable wavelength, and high efficiency. They can be used in fields such as sterilization, medical beauty, covert communication, and biochemical detection. [0003] White light LED packaging is usually coated with a layer of organic packaging glue (such as epoxy resin, silica gel, etc.) on the surface of the LED chip to ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L33/52H01L33/58H01L33/00
CPCH01L2224/48091H01L2224/48227H01L2924/16195H01L2924/181H01L2924/00014H01L2924/00012
Inventor 陈明祥彭洋程浩罗小兵刘胜
Owner HUAZHONG UNIV OF SCI & TECH