Microvibration prevention building structure and constructing method thereof

Abstract

The invention discloses a microvibration prevention building structure and a constructing method thereof. Multiple microvibration prevention measures are taken, and the method comprises the steps that environmental vibration testing and geological exploration are carried out on a planned site in an early stage, and a plot which is away from main lines of communication and away from factories having large machinery is selected; and the anti-microvibration rigidity of a building is enhanced by constructing structures, such as pile foundations, raft foundations, densified column nets, dense-hole floors and microvibration prevention walls. A power area, support areas and a production area are separated, and block-by-block and layer-by-layer pouring and vibration are carried out on concrete structures, such as ultra-thick and large-size rafts, the dense-hole floors and the microvibration prevention walls during construction, so that quality of concrete is ensured, the production plant building meets the anti-microvibration requirement of precision production equipment, the traditional thinking mode that anti-microvibration can only be performed from certain aspect is changed, for example, vibration isolators or other vibration isolation devices can be installed on precision equipment, and thus the microvibration prevention building structure has certain reference and enlightening significances for people constructing other similar buildings in the future.

Description

technical field [0001] The invention relates to a fixed building and its construction method, in particular to an anti-microvibration building structure and its construction method. Background technique [0002] In the past ten years, the level of integrated circuit processing technology has been developing rapidly. At present, the processing level of large-scale production of major international integrated circuit foundries has reached 0.13 μm, such as the processing technology of Intel, AMD and IBM. The level has reached 65nm or even 45nm, and the line width of my country's integrated circuit industry has also reached 0.18-0.13μm. [0003] In the production process of integrated circuits, due to the smaller and smaller line width, there are more and more environmental factors, such as dust in the air, impurities in industrial gases, microorganisms in water, bacteria and dust on people, The pollution caused by electromagnetic interference, noise and vibration will all affec...

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Problems solved by technology

[0006] In order to ensure the anti-fretting performance of precision production equipment, the existing integrated circuit manufacturers simply set vibration isolators or other vibration isolation devices on the precision equipment, without comprehensive measures to strengthen the anti-fretting effect. Its vibration isolation is not very ideal

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